SOP 29x12F

PG-DIP-23-901

Package details

  • Package Material
    PG
  • Package Family
    PG-DIP
  • Terminals
    23
  • Variant
    901
  • Exposed Paddle
    Yes
  • Body Length (mm)
    29.0
  • Body Width (mm)
    12.0
  • Min. Terminal Pitch (mm)
    1.95
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
     
    500
    1
  • TUBE
    Pieces/Reel
    Reels/Box
     
    15
    1
Infineon single (SIP) and dual inline packages (DIP) are offered as various families. The straight lead termination design allows for high robustness board mounting using through-hole technology (THT). The leads of THD are inserted in drilled holes of the board prior to soldering. During pre-mount processing special care must be taken e.g. during lead bending. Typical products are power ICs, power MOSFET, memories, intelligent power modules (IPM), photovoltaic relays and isolators, lighting ICs, and more.

Image Gallery

SPO PG-DIP-23-901
SPO PG-DIP-23-901
SPO PG-DIP-23-901 SPO PG-DIP-23-901 SPO PG-DIP-23-901

Documents and drawings