MODULE-35 (002-29354)

LG-MLGA-35-802

Package details

  • Package Material
    LG
  • Package Family
    LG-MLGA
  • Terminals
    35
  • Variant
    802
  • Exposed Paddle
    No
  • Body Length (mm)
    12.0
  • Body Width (mm)
    16.61
  • Min. Terminal Pitch (mm)
    0.97
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
     
    500
    1
Infineon module land grid array (MLGA) packages are offered as different variants. MLGA type components are built on an advanced laminate substrate with multiple layers of circuitry. The system on module (SOM) provides a specific function by system integration on board-level. The concerted devices allow for an efficient circuitry, a compact module design and a cost-effective application. Infineon modules can consist of multiple micro-electro-mechanical system (MEMS), micro-controllers (MC) as well as active and passive devices. The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). Special gripping might be needed for handling the modules during pick&place. Typical products are CO<sub>2</sub> sensors, Bluetooth® modules, and integrated power stages.

Image Gallery

LG-MLGA-35-802_Footprint Drawing
LG-MLGA-35-802_Footprint Drawing
LG-MLGA-35-802_Footprint Drawing LG-MLGA-35-802_Footprint Drawing LG-MLGA-35-802_Footprint Drawing
LG-MLGA-35-802_Package Outline LG-MLGA-35-802_Package Outline LG-MLGA-35-802_Package Outline
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Documents and drawings

Documents and drawings