PG-DSOSP

Infineon dual small outline sensor pressure (DSOSP) packages are offered as different variants. The leadframe based cavity type packages feature a centrally arranged micro-electro-mechanical system (MEMS) sensor chip. The gullwing lead connection design allows for high-throughput board mounting using surface mount technology (SMT). The open signal ports in the covering lid call for extra consideration during board mounting processes. Typical products are space-efficient solutions e.g. for barometric (BAP) & manifold (MAP) sensors, pressure sensors for side crash detection (SAB), and tire pressure sensors (TPMS).