Infineon presents the TDM4218U108 module and expands

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Infineon presents the TDM4218U108 module and expands the IBC portfolio for 48-V AI compute architectures

Technology news

Mar 17, 2026

Munich, Germany – 17 March – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced its first medium-voltage IBC module, TDM4218U108, designed to accelerate 48-volt AI compute architectures. The new IBC solution helps hyperscalers and server OEMs increase power density while reducing power distribution losses and cooling effort, supporting lower total cost of ownership. The TDM4218U108 combines a compact, industry-standard 42 x 18 mm² footprint with high-efficiency conversion enabled by Infineon’s proprietary Hybrid Switched-Capacitor (HSC) topology and application-optimized semiconductors.

As a plug-and-play module, the TDM4218U108 significantly simplifies the implementation of 48-V architectures. It can be combined with both standard 48-V power supplies and Infineon's HV IBC solutions, which convert 800 VDC to 50 V.

“With the TDM4218U108, we are extending Infineon’s power delivery portfolio with our first IBC module for 48-V AI compute, backed by Infineon’s cutting-edge semiconductor expertise and deep system-level know-how,” said Magdalene Boebel, Senior Vice President and Business Line Head of Power System IC at Infineon. “Our plug-and-play module solution enables our customers to minimize engineering time and hence supports faster time-to-market and higher platform efficiency, while simplifying power delivery and strengthening reliability for maximum uptime.”

The TDM4218U108 delivers up to 1.3 kW thermal design power (TDP) with 2x TDP pulse capability to support fast, load-driven transients in AI systems. The module provides unregulated 8:1 conversion of an input bus voltage ranging from 40 V to 60 V, leveraging Infineon’s premium-quality power MOSFETs to enhance reliability under high-current transients and thermal stress. Developed based on Infineon’s proprietary HSC topology, the module achieves 98 percent peak efficiency. Compared to conventional LLC approaches, HSC topology enables a 2 percent efficiency gain at operating points relevant for AI compute while additionally enabling 35 percent higher output power at comparable bill-of-material cost.

The TDM4218U108 is optimized to work with Infineon’s DC conversion power modules, enabling vertical power delivery close to the point of load. With increasing power requirements, this approach helps minimize system-level power distribution losses. The TDM4218U108 strengthens Infineon’s AI data center portfolio. To support customers’ next-generation compute platforms, Infineon is broadening its IBC module roadmap and will introduce additional products soon.

The MV IBC module is optimized for use with Infineon’s broad AI server power delivery portfolio from grid to core – spanning solid-state transformers and circuit breakers, high-voltage and intermediate bus conversion, as well as second-stage DC conversion power modules. Leveraging the benefits of silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) to achieve the highest efficiency, density, and robustness, Infineon gives customers a clear path to end-to-end power architectures with proven high-quality components, consistent design support, and scalable performance for next-generation AI server platforms.

Availability
Learn more about the TDM4218U108 IBC module from Infineon here.

APEC 2026
Don’t miss Infineon at APEC 2026, located at the Henry B. Gonzalez Convention Center in San Antonio, Texas, from March 22-26, 2026. Visit Infineon’s booth #1619 to see one of the industry’s broadest power device portfolios covering all relevant power technologies in silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). To book a media interview, please contact media.relations@infineon.com.

Infineon AI Day Taiwan
The Infineon We Power AI Day is an industry event for business and technology leaders in Taiwan. Together with our ecosystem partners and customers, we explore the latest advances in the field of power technologies. The goal is a sustainable AI infrastructure enabled by Infineon’s innovative solutions – from grid to core. The event will take place in Taipei on March 31.

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 57,000 employees worldwide (end of September 2025) and generated revenue of about €14.7 billion in the 2025 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).