IMBG120R030M1H
not for new design
RoHS Compliant
Lead-free

IMBG120R030M1H

CoolSiC™ 1200 V SiC Trench MOSFET in TO-263-7 package

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IMBG120R030M1H
IMBG120R030M1H


Product details


OPN
IMBG120R030M1HXTMA1
Product Status not for new design
Infineon Package
Package Name D2PAK 7-pin
Packing Size 1000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes

Product Status not for new design
Infineon Package
Package Name D2PAK 7-pin
Packing Size 1000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
The CoolSiC™ 1200 V, 30 mΩ SiC MOSFET in a D2PAK-7L (TO-263-7) package build on a state-of-the-art trench semiconductor process optimized to combine performance with reliability in operation. The low power losses of CoolSiC technology, combined with .XT interconnection technology in a new 1200 V optimized SMD package, enables top efficiency and passive cooling potential in applications such as drives, chargers and industrial powers supplies.

Features

  • Very Low switching losses
  • Short-circuit withstand time, 3 µs
  • Fully controllable dV/dt
  • Benchmark gate threshold voltage
  • VGS(th) = 4.5 V
  • Robust against parasitic turn-on
  • 0V turn-off gate voltage applicable
  • Robust diode for hard commutation
  • .XT interconnection technology
  • Package creepage distances > 6.1 mm
  • And clearance distances, > 6.1 mm
  • Sense pin for optimized switching

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Design resources

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