Intelligent power modules (IPM)

CIPOS™ Intelligent Power Modules for high performance and high intergration

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Highly integrated Intelligent Power Modules (IPM)

We provide a comprehensive portfolio of Intelligent Power Modules (IPMs) covering a wide range of semiconductor technologies, package types, and voltage/current ratings. The series includes CIPOS™ Nano, CIPOS™ Micro, CIPOS™ Mini, and CIPOS™ Maxi, each optimized for specific power levels and application requirements. 

Our IPMs integrate high-performance MOSFETs, IGBTs, and SiC devices with next-generation gate driver ICs for precise switching control, as well as optimized thermo-mechanical designs for improved heat dissipation and mechanical robustness. These technologies enable higher power density, reduced conduction and switching losses, and extended system lifetime under demanding operating conditions. 

CIPOS™ IPM applications and highlights

CIPOS™ IPMs are highly integrated, compact power modules delivering a complete, optimized power stage in a single package. Covering power ranges from 20 W to 20 kW, they simplify motor drive and power conversion design, reduce BOM costs, lower component count, and accelerate time-to-market. Built-in protection features and electrically isolated packages enhance system reliability and robustness.

Applications include dishwashers, fans, air conditioning, washing machines, refrigerators, HVAC, and industrial motor drives. An automotive-grade portfolio supports HV auxiliary drives such as e-compressors, e-fans, e-pumps, and e-suspension, as well as on-board chargers and HV DC-DC converters.

CIPOS™ IPM portfolio

The CIPOS™ family offers four scalable variants — Nano, Micro, Mini, and Maxi — each optimized for specific voltage, power, and cost requirements. This makes it easy to select the best fit for your design targets in package size, efficiency, robustness, and overall system cost.

  • CIPOS™ Nano: Smallest, most cost-effective modules for space-constrained designs, supporting applications from 100 V to 600 V
  • CIPOS™ Micro: High efficiency in a compact package, optimized for low-power applications up to 500 W, typically in 600 V class designs
  • CIPOS™ Mini: High power density with flexible current scaling from 4 A to 50 A, enabling up to 8 kW in 600 V to 650 V class applications
  • CIPOS™ Maxi: Most compact and robust 1200 V class IPM, integrating CoolSiC™ (Gen 1/2) or TRENCHSTOP™ IGBT4/7 with a rugged 6-channel SOI gate driver. The automotive variant is fully qualified to AEC-Q100, AEC-Q101, and AQG324

Highly integrated Intelligent Power Modules (IPM)

We provide a comprehensive portfolio of Intelligent Power Modules (IPMs) covering a wide range of semiconductor technologies, package types, and voltage/current ratings. The series includes CIPOS™ Nano, CIPOS™ Micro, CIPOS™ Mini, and CIPOS™ Maxi, each optimized for specific power levels and application requirements. 

Our IPMs integrate high-performance MOSFETs, IGBTs, and SiC devices with next-generation gate driver ICs for precise switching control, as well as optimized thermo-mechanical designs for improved heat dissipation and mechanical robustness. These technologies enable higher power density, reduced conduction and switching losses, and extended system lifetime under demanding operating conditions. 

CIPOS™ IPM applications and highlights

CIPOS™ IPMs are highly integrated, compact power modules delivering a complete, optimized power stage in a single package. Covering power ranges from 20 W to 20 kW, they simplify motor drive and power conversion design, reduce BOM costs, lower component count, and accelerate time-to-market. Built-in protection features and electrically isolated packages enhance system reliability and robustness.

Applications include dishwashers, fans, air conditioning, washing machines, refrigerators, HVAC, and industrial motor drives. An automotive-grade portfolio supports HV auxiliary drives such as e-compressors, e-fans, e-pumps, and e-suspension, as well as on-board chargers and HV DC-DC converters.

CIPOS™ IPM portfolio

The CIPOS™ family offers four scalable variants — Nano, Micro, Mini, and Maxi — each optimized for specific voltage, power, and cost requirements. This makes it easy to select the best fit for your design targets in package size, efficiency, robustness, and overall system cost.

  • CIPOS™ Nano: Smallest, most cost-effective modules for space-constrained designs, supporting applications from 100 V to 600 V
  • CIPOS™ Micro: High efficiency in a compact package, optimized for low-power applications up to 500 W, typically in 600 V class designs
  • CIPOS™ Mini: High power density with flexible current scaling from 4 A to 50 A, enabling up to 8 kW in 600 V to 650 V class applications
  • CIPOS™ Maxi: Most compact and robust 1200 V class IPM, integrating CoolSiC™ (Gen 1/2) or TRENCHSTOP™ IGBT4/7 with a rugged 6-channel SOI gate driver. The automotive variant is fully qualified to AEC-Q100, AEC-Q101, and AQG324
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