Cutting-edge solutions for Solar, Inverterized Drives, UPS, Welding and other hard switching applications.
TRENCHSTOP™ Advanced Isolation
The new TRENCHSTOP™ Advanced Isolation represent the cutting-edge technology in isolated packages. 35% lower thermal resistance R th(j-h) of advance isolation material compared to high grade Iso-foil enables effective and reliable thermal path from chip to the heatsink.
Bigger active chip area of the TO-247PLUS package can accommodate up to 75 A IGBT with 75 A diode in TO-247 footprint. Higher power density of TO-247PLUS can be used to reduce paralleling, increase system power density or system power output.