EasyPACK™

EasyPACK™ is an easy-to-handle and efficient module for power inverters and converters up to 100 kW

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Overview

For our automotive EasyPACK™, the package of the industrial Easy modules has been improved and qualified to meet automotive requirements. It enables a fast and easy assembly process. With its two footprints Easy 1B and Easy 2B, it provides a platform for different power classes using both of our leading IGBT and CoolSiC™ technologies. Customizations to fit customer’s needs are possible by adding further chip technologies in different topologies.

Key Features

  • Automotive qualified EasyPACK™
  • Available with Si IGBT and CoolSiC™
  • Fast and easy assembly process
  • Two footprints: Easy 1B and Easy 2B
  • PressFIT contact technology

Products

About

  • Flexible module with different topologies, enabling different inverter geometries and further motor integration
  • PressFIT pins for ease of assembly for PCB mounting
  • Using Infineon's benchmark chip technologies matching specific application requirements
  • Cost-effective module
  • High volume manufacturing experience
  • Easy system assembly - PressFIT contact technology for solder-less mounting
  • Easy design – integrated module solution with optimized thermal management
  • Reliability – insulated solution with high creepage and clearance distances
  • Low stray inductance
  • Automotive EasyPACK™ 1B and 2B provides a platform for flexible topologies from auxiliaries to inverters of high-voltage applications
  • Built upon on well-established industrial EasyPACK™ version
  • Automotive EasyPACK™ fully qualified and validated according to automotive standards to ensure reliable operation under harsh environmental conditions in high-voltage automotive applications
  • Automotive EasyPACK™ helps you to simplify insulation, design, and assembly

  • Flexible module with different topologies, enabling different inverter geometries and further motor integration
  • PressFIT pins for ease of assembly for PCB mounting
  • Using Infineon's benchmark chip technologies matching specific application requirements
  • Cost-effective module
  • High volume manufacturing experience

  • Easy system assembly - PressFIT contact technology for solder-less mounting
  • Easy design – integrated module solution with optimized thermal management
  • Reliability – insulated solution with high creepage and clearance distances
  • Low stray inductance

  • Automotive EasyPACK™ 1B and 2B provides a platform for flexible topologies from auxiliaries to inverters of high-voltage applications
  • Built upon on well-established industrial EasyPACK™ version
  • Automotive EasyPACK™ fully qualified and validated according to automotive standards to ensure reliable operation under harsh environmental conditions in high-voltage automotive applications
  • Automotive EasyPACK™ helps you to simplify insulation, design, and assembly

Documents

Design resources

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community ", "labelEn" : "Ask the community " }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions ", "labelEn" : "View all discussions " } ] }