FF17MR12W1M1HP_B11
Active and preferred
RoHS Compliant

FF17MR12W1M1HP_B11

EasyDUAL™ 1B CoolSiC™ MOSFET half-bridge module 1200 V
Datasheet
ea.
in stock

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

FF17MR12W1M1HP_B11
FF17MR12W1M1HP_B11
ea.
Datasheet


Product details

  • Applications
    Solar, UPS, EV Charger, ESS
  • Configuration
    Half-bridge
  • Dimensions (length)
    62.8 mm
  • Dimensions (width)
    33.8 mm
  • Features
    PressFIT, TIM
  • Housing
    Easy 1B
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C)
    17 mΩ

Recommended
OPN
FF17MR12W1M1HPB11BPSA1
Product Status active and preferred
Infineon Package AG-EASY1B
Package Name N/A
Packing Size 30
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
AT
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package AG-EASY1B
Package Name -
Packing Size 30
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
AT
ea.
in stock
EasyDUAL™ 1B 1200 V, 17 mΩ half-bridge module with CoolSiC™ MOSFET enhanced generation 1, integrated NTC temperature sensor, pre-applied thermal interface material and PressFIT Contact Technology

Features

  • Best-in-class package: 12 mm height
  • Easy module packages
  • Very low module stray inductance
  • Wide RBSOA
  • 1200 V CoolSiC™ MOSFET
  • Gate drive vol.: +15…+18 V & 0…-5 V
  • Max. gate-source v.: +23 V & -10 V
  • Tvjop under overload condi. < 175°C
  • PressFIT pins
  • Integrated NTC temperature sensor
  • Thermal interface material
Documents

Design resources

Partner solutions

Developer community