SG-XFWLB-16-1

Package details

  • Package Material
    SG
  • Package Family
    SG-XFWLB
  • Terminals
    16
  • Variant
    1
  • Exposed Paddle
    No
  • Body Length (mm)
    1.64
  • Body Width (mm)
    1.8
  • Min. Terminal Pitch (mm)
    0.4
Infineon wafer level ball grid array packages (WLB) are offered as various families. They are available as very thin (V), very very thin (W), ultra thin (U), and extemely thin (X) versions. Alternative and legacy designations are embedded WLB (eWLB), wafer level chip scale package (WLCSP) or wafer level ball grid array (WLBGA) package. The embedded WLB feature a minimum plastic mold body that can be rectangular or square. They are chip scale packages with fan-in/fan-out redistribution layer that marginally extends over the silicon die. The pre-soldered ball-shaped terminations allow for high-throughput board mounting using surface mount technology (SMT). Typical products are radar sensors, micro controllers, magnetic sensors, and more.

Documents and drawings

Documents and drawings