PG-UF2BGA-42-1

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Package details

  • Package Material
    PG
  • Package Family
    PG-UF2BGA
  • Terminals
    42
  • Variant
    1
  • Exposed Paddle
    No
  • Body Length (mm)
    6.7
  • Body Width (mm)
    3.3
  • Min. Terminal Pitch (mm)
    0.5
Infineon ball grid array (BGA) packages for radar sensors are offered as various families. They are available as very thin (V), very very thin (W), and ultra thin (U) versions. Finepitch (F) products are specifically designated. Legacy designations may inlcude ultra flip-chip ball grid array (FCBGA). The packages carry the die on the bottom side of the fanout laminate substrate and typically come with an integrated antenna. The pre-soldered ball-shaped terminations allow for high-throughput board mounting using surface mount technology (SMT). The footprints can be symmetric to non-symmetric. The solder ball terminations provide a stable stand-off after board mounting. Typical products are e.g. motion detection by radar sensing where an optimized package size is required.

Image Gallery

PG-UF2BGA-42-1_Tape and Reel
PG-UF2BGA-42-1_Tape and Reel
PG-UF2BGA-42-1_Tape and Reel PG-UF2BGA-42-1_Tape and Reel PG-UF2BGA-42-1_Tape and Reel
PG-UF2BGA-42-1_Footprint Drawing PG-UF2BGA-42-1_Footprint Drawing PG-UF2BGA-42-1_Footprint Drawing
PG-UF2BGA-42-1_Package Outline PG-UF2BGA-42-1_Package Outline PG-UF2BGA-42-1_Package Outline
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Documents and drawings