TEQFP-176 (002-25324)

PG-TQFP-176-801

Package details

  • Package Material
    PG
  • Package Family
    PG-TQFP
  • Terminals
    176
  • Variant
    801
  • Exposed Paddle
    Yes
  • Body Length (mm)
    24.0
  • Body Width (mm)
    24.0
  • Min. Terminal Pitch (mm)
    0.5
Infineon quad flat packages (QFP) are offered as various families. Legacy designations may include TEQFP or PQFP. The component may feature an exposed die pad at the center of the package landing area. It allows for optimum heat transfer and electrical grounding. The gullwing shaped leads are arranged on all four sides of the package mold body. They allow for high-throughput board mounting using surface mount technology (SMT). Typical applications are micro controllers (MCU), memory, current control, and gate driver ICs.

Image Gallery

PG-TQFP-176-801_Bakeable Trays
PG-TQFP-176-801_Bakeable Trays
PG-TQFP-176-801_Bakeable Trays PG-TQFP-176-801_Bakeable Trays PG-TQFP-176-801_Bakeable Trays
PG-TQFP-176-801_Footprint Drawing PG-TQFP-176-801_Footprint Drawing PG-TQFP-176-801_Footprint Drawing
PG-TQFP-176-801_Package Outline PG-TQFP-176-801_Package Outline PG-TQFP-176-801_Package Outline
PG-TQFP-176-801_Tape and Reel PG-TQFP-176-801_Tape and Reel PG-TQFP-176-801_Tape and Reel

Documents and drawings