PG-TQFP-100-3

Package details

  • Package Material
    PG
  • Package Family
    PG-TQFP
  • Terminals
    100
  • Variant
    3
  • Exposed Paddle
    No
  • Body Length (mm)
    14.0
  • Body Width (mm)
    14.0
  • Min. Terminal Pitch (mm)
    0.5
  • TRAY
    Pieces/Reel
    Reels/Box
     
    1
    1
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    1000
    1
    330
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    1400
    1
    330
  • TRAY
    Pieces/Reel
    Reels/Box
     
    540
    6
  • TRAY
    Pieces/Reel
    Reels/Box
     
    90
    1
Infineon quad flat packages (QFP) are offered as various families. Legacy designations may include TEQFP or PQFP. The component may feature an exposed die pad at the center of the package landing area. It allows for optimum heat transfer and electrical grounding. The gullwing shaped leads are arranged on all four sides of the package mold body. They allow for high-throughput board mounting using surface mount technology (SMT). Typical applications are micro controllers (MCU), memory, current control, and gate driver ICs.

Image Gallery

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gpp09189.gif
gpp09189.gif gpp09189.gif gpp09189.gif
PG-MQFP-BKT PG-MQFP-BKT PG-MQFP-BKT
cppg9060.gif cppg9060.gif cppg9060.gif
PG-TQFP-100-3_Footprint Drawing PG-TQFP-100-3_Footprint Drawing PG-TQFP-100-3_Footprint Drawing

Documents and drawings