PG-DSOF-8-162

Package details

  • Package Material
    PG
  • Package Family
    PG-DSOF
  • Terminals
    8
  • Variant
    162
  • Exposed Paddle
    No
  • Body Length (mm)
    7.0
  • Body Width (mm)
    7.0
  • Min. Terminal Pitch (mm)
    1.27
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    1500
    1
    330
Infineon dual small outline flat leads (DSOF) packages for pressure sensors are offered as different variants. The leadframe based cavity type packages feature a centrally arranged micro-electro-mechanical system (MEMS) sensor chip. The flat lead connection design allows for high-throughput board mounting using surface mount technology (SMT). The open signal ports in the covering lid call for extra consideration during board mounting processes. Typical products are space-efficient solutions e.g. for barometric (BAP) & manifold (MAP) sensors, pressure sensors for side crash detection (SAB), and tire pressure sensors (TPMS).

Image Gallery

SPO PG-DSOF-8-162
SPO PG-DSOF-8-162
SPO PG-DSOF-8-162 SPO PG-DSOF-8-162 SPO PG-DSOF-8-162
FPD PG-DSOF-8-162 FPD PG-DSOF-8-162 FPD PG-DSOF-8-162
TNR PG-DSOF-8-162 TNR PG-DSOF-8-162 TNR PG-DSOF-8-162

Documents and drawings