PG-DIP-8-905

Package details

  • Package Material
    PG
  • Package Family
    PG-DIP
  • Terminals
    8
  • Variant
    905
  • Exposed Paddle
    No
  • Body Length (mm)
    5.98
  • Body Width (mm)
    3.99
  • Min. Terminal Pitch (mm)
    1.27
  • TUBE
    Pieces/Reel
    Reels/Box
     
    50
    1
Infineon single (SIP) and dual inline packages (DIP) are offered as various families. The straight lead termination design allows for high robustness board mounting using through-hole technology (THT). The leads of THD are inserted in drilled holes of the board prior to soldering. During pre-mount processing special care must be taken e.g. during lead bending. Typical products are power ICs, power MOSFET, memories, intelligent power modules (IPM), photovoltaic relays and isolators, lighting ICs, and more.

Image Gallery

SPO PG-DIP-8-905
SPO PG-DIP-8-905
SPO PG-DIP-8-905 SPO PG-DIP-8-905 SPO PG-DIP-8-905

Documents and drawings