PG-ATSLP-10-50

Package details

  • Package Material
    PG
  • Package Family
    PG-ATSLP
  • Terminals
    10
  • Variant
    50
  • Exposed Paddle
    Yes
  • Body Length (mm)
    1.5
  • Body Width (mm)
    1.1
  • Min. Terminal Pitch (mm)
    0.4
Infineon thin small leadless packages (TSLP) are offered as various families. They are available as advanced thin (AT) and thin super (TS) versions. Their small outline and leadframe-less construction makes them ideal for light-weight applications. The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). Drop-in solutions with identical footprint may be found the package family of thin small nonleaded packages (TSNP). Typical applications are linear voltage regulators, switches, tuners, diodes, ESD devices, RF mixers, general purpose and RF transistors, and more.

Image Gallery

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PG-ATSLP-10-50_PNG PG-ATSLP-10-50_PNG PG-ATSLP-10-50_PNG
PG-ATSLP-10-50_PNG PG-ATSLP-10-50_PNG PG-ATSLP-10-50_PNG
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Documents and drawings

Documents and drawings