LG-WIQFN

Infineon laminate based integrated quad flat nonleaded (IQFN) packages are offered as different families. They are available as very very thin (W) and ultra thin (U) versions. Alternative designations are Driver DrBlade and DrBlade 2. The package construction utilizes a laminate substrate to carry multiple integrated dies. The electrical connection is to the bottom of the package rather than around its perimeter. The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). Typical products are MOSFET.