XENSIV™ MEMS microphones
The popularity of voice user interfaces and the usage of audio recording to share information and experiences are increasing dramatically. However, the performance of microphones often limits the potential of today’s cutting-edge devices. Not anymore!
Infineon XENSIV™ MEMS microphones introduce a new performance class for digital MEMS microphones that overcomes existing audio chain limitations. IM69D130 is designed for applications where low self-noise (high SNR), wide dynamic range, low distortions and a high acoustic overload point are required.
Features & Benefits
Infineon´s Dual Backplate (DBP) MEMS technology
Infineon's dual backplate MEMS technology is based on a miniaturized symmetrical microphone design, similar as utilized in studio condenser microphones, and results in high linearity of the output signal within a dynamic range of 105 dB.
The microphone noise floor is at 25 dB[A] (69 dB[A] SNR) and distortion does not exceed 1 percent even at sound pressure levels of 128 dB SPL (AOP 130 dB SPL). The flat frequency response (28 Hz low-frequency roll-off) and tight manufacturing tolerance result in close phase matching of the microphones, which is important for multi-microphone (array) applications.
- High quality audio capturing: e.g. cameras, camcorders, conference systems
- Voice user interface: e.g. smart speaker, home automation and IoT devices
- Active noise cancellation: headphones and earphones
- Audio pattern detection: predictive maintenance, security or safety applications
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