
Introducing CoolSET™ System in Package (SiP)
We are excited to introduce the latest innovation of our portfolio: CoolSET™ System in Package (SiP). This product family is designed to simplify system design and development by integrating a high-voltage power switch, primary and secondary controllers, and isolated communication via CT Link technology.
The CoolSET™ System in Package (SiP) solution enables the creation of more feature-rich end-user products while significantly reducing the number of required discrete system components, resulting in a lower BOM and a more streamlined design process. CoolSET™ SiP integrates an 800 V CoolMOS™ P7, ZVS primary controller, and secondary SR controller with CT Link technology for isolated communication in a small SMD footprint for higher power delivery. The ZVS flyback solution reduces BOM, switching losses, and improves EMI performance while achieving higher than 94% efficiency. With industrial-grade qualification (JEDEC47/20/22), the CoolSET™ SiP products are ideal as an auxiliary power supply for major home appliances and AI server applications.
Explore our reference designs
Priority | Board name | Pout (W) |
Vin range | Vout 1 |
Vout non iso | n at 230 VAC full load |
1 | REF_60W1_ZVS_186EM (ICE186EM) | 60 | 90-264 VAC | 12 V / 5 A | 15 V / 0.15 A | >93% |
2 | REF_45W1_ZVS_184LM (ICE184LM) | 45 | 90-264 VAC | 12 V / 3.75 A | >92% | |
3 | REF_45W1_ZVS_184EM (ICE184EM) | 45 | 90-264 VAC | 12 V / 3.75 A | 15 V / 0.15 A | >92% |