Introducing CoolSET™ System in Package (SiP)

We are excited to introduce the latest innovation of our portfolio: CoolSET™ System in Package (SiP). This product family is designed to simplify system design and development by integrating a high-voltage power switch, primary and secondary controllers, and isolated communication via CT Link technology.

The CoolSET™ System in Package (SiP) solution enables the creation of more feature-rich end-user products while significantly reducing the number of required discrete system components, resulting in a lower BOM and a more streamlined design process. CoolSET™ SiP integrates an 800 V CoolMOS™ P7, ZVS primary controller, and secondary SR controller with CT Link technology for isolated communication in a small SMD footprint for higher power delivery. The ZVS flyback solution reduces BOM, switching losses, and improves EMI performance while achieving higher than 94% efficiency. With industrial-grade qualification (JEDEC47/20/22), the  CoolSET™ SiP products are ideal as an auxiliary power supply for major home appliances and AI server applications.

Key Features

  • Integrated avalanche rugged 800 V CoolMOS™ P7 SJ MOSFET
  • Integrated 950 V startup cell
  • Novel zero-voltage switching (ZVS) flyback operation
  • Built-in primary side power switch control and secondary side feedback control
  • Integrated primary and secondary functionality with robust “CT Link” technology for reinforced isolation
  • Integrated synchronous rectification, eliminating the need for an external controller
  • Reduced component count and complexity by integrating synchronous rectification and LDO enable pin
  • Meet the stringiest energy standards with high efficiency and < 30 mW stand-by power
  • Enabling output power up to 60 W in small DSO-package (Si)
CoolSET™ sip product image
CoolSET™ sip product image
CoolSET™ sip product image
CoolSET SIP Applications Image
CoolSET SIP Applications Image
CoolSET SIP Applications Image

Explore our reference designs

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