Intermediate Bus Converter (IBC)

High efficiency and high power density 800V and 48 V power distribution solutions for hyperscale datacenters and AI servers

About

Intermediate Bus Converters (IBCs) are essential for efficient medium (48V) and high-voltage (±400V/800V) in modern AI servers. Power is distributed from the rack busbar to the baseboard, where  regulated or unregulated IBCs convert it into an intermediate rails for Point‑of‑Load (POL) regulators supplying XPUs and AI ASICs. Increasing rack power architectures up to 800V,limited space near accelerators, and dynamic loads drive the need for high efficiency, high power desnity, low EMI, and strong thermal performance. 

Infineon IBC solutions support both MV and HV architectures with optimized modules and validated reference designs that reduce design risk and accelerate development. Using CoolGaN™ transistors and  OptiMOS™ MOSFETs for maximum efficiency, combined with EiceDRIVER™ gate drivers for fast and robust switching, delivers superior performance. Integrated XDP™ digital power controllers and PSOC™ microcontrollers enable control, telemetry, and protection

These technologies enable scalable, high-efficiency, high-density IBC designs that imporve system reliability and reduce time-to-market for next-generation AI infrastructure. 

For 48V architectures, Infineon’s medium-voltage (MV) IBC solutions help customers achieve exceptional efficiency, power density and overall system value. Based on Infineon’s proprietary Hybrid Switched Capacitor (HSC) and Synchronous-HSC (S-HSC) topologies, these solutions support unregulated fixed ratio conversion with 4:1, 8:1 and 10:1 conversion ratios for optimized step-down stages in conventional hyperscal server and today’s AI server power trains

Seamless integration with Infineon’s second-stage DC-conversion power modules improves end-to-end system effciciency to ~90%, reducing lossess and cooling requirements. For transformer-less, regulated IBC designs, Infineon multiphase buck solutions simplify implementation and enable scalable architctures.

The use of CoolGaN™ devices combined with EiceDRIVER™ gate drivers deliver higher efficiency and switching performance compared to industry standard approaches in high efficiency designs.

Next-generation AI data centers are adopting high-voltage (HV) rack architectures, moving up to ±400 V and 800V to further reduce distribution losses and improve power delivery at high power levels rack.

In such systems, IBCs enable efficient step-down conversion to intermediate rails such as 48V/50V, 12V, or 6V for downstream POL stages.

Infineon high-voltage IBC portfolio supports unregulated conversion from 800 V/±400 V input voltage, down to intermediate rails such as 50 V, 12 V or 6 V, based on proven open-source LLC topology. Designed with Infineon’s product quality and implemented as reference designs optimized for Infineon’s Si and GaN device technologies, these solutions help accelerate development while addressing efficiency, power density and EMI challenges. 

Combined with Infineon’s capability to cover the full server-rack power flow—from high-voltage conversion to control and protection—customers can optimize system performance end-to-end.

Infineon complements IBC offering with advanced power path protection solutions that ensure controlled startup, stable operation, and robust fault handling in high-density AI server racks.

They protect IBC and other critical components within computing trays during power ramp-up, improving system reliability and preventing disruptions in demanding, high-density AI server environments.

With downtime costs reaching up to $5 million per hour, reliabile hotswap capability is critical. Infineon's portoflio -  including  hot-swap controllers, linear MOSFETs, and eFuses - enables safe server blade insertion and removal, maintaining continuous operation.

For MV systems, XDP700 series with linear FETs provide accurate monitoring and protection. For HVDC systems, the HV hot-swap reference solutions based on SiC JFET technology deliver robust performance, effectively handling high inrush currents under transient conditions to ensure reliable system protection. 

Toegther, they improve system uptime, reliability, and protection. Combined with Infineon’s IBC solutions, they enable stable, long-term operation for conventional as well as AI servers, helping optimize total cost of ownership (TCO).

Intermediate Bus Converters (IBCs) are essential for efficient medium (48V) and high-voltage (±400V/800V) in modern AI servers. Power is distributed from the rack busbar to the baseboard, where  regulated or unregulated IBCs convert it into an intermediate rails for Point‑of‑Load (POL) regulators supplying XPUs and AI ASICs. Increasing rack power architectures up to 800V,limited space near accelerators, and dynamic loads drive the need for high efficiency, high power desnity, low EMI, and strong thermal performance. 

Infineon IBC solutions support both MV and HV architectures with optimized modules and validated reference designs that reduce design risk and accelerate development. Using CoolGaN™ transistors and  OptiMOS™ MOSFETs for maximum efficiency, combined with EiceDRIVER™ gate drivers for fast and robust switching, delivers superior performance. Integrated XDP™ digital power controllers and PSOC™ microcontrollers enable control, telemetry, and protection

These technologies enable scalable, high-efficiency, high-density IBC designs that imporve system reliability and reduce time-to-market for next-generation AI infrastructure. 

For 48V architectures, Infineon’s medium-voltage (MV) IBC solutions help customers achieve exceptional efficiency, power density and overall system value. Based on Infineon’s proprietary Hybrid Switched Capacitor (HSC) and Synchronous-HSC (S-HSC) topologies, these solutions support unregulated fixed ratio conversion with 4:1, 8:1 and 10:1 conversion ratios for optimized step-down stages in conventional hyperscal server and today’s AI server power trains

Seamless integration with Infineon’s second-stage DC-conversion power modules improves end-to-end system effciciency to ~90%, reducing lossess and cooling requirements. For transformer-less, regulated IBC designs, Infineon multiphase buck solutions simplify implementation and enable scalable architctures.

The use of CoolGaN™ devices combined with EiceDRIVER™ gate drivers deliver higher efficiency and switching performance compared to industry standard approaches in high efficiency designs.

Next-generation AI data centers are adopting high-voltage (HV) rack architectures, moving up to ±400 V and 800V to further reduce distribution losses and improve power delivery at high power levels rack.

In such systems, IBCs enable efficient step-down conversion to intermediate rails such as 48V/50V, 12V, or 6V for downstream POL stages.

Infineon high-voltage IBC portfolio supports unregulated conversion from 800 V/±400 V input voltage, down to intermediate rails such as 50 V, 12 V or 6 V, based on proven open-source LLC topology. Designed with Infineon’s product quality and implemented as reference designs optimized for Infineon’s Si and GaN device technologies, these solutions help accelerate development while addressing efficiency, power density and EMI challenges. 

Combined with Infineon’s capability to cover the full server-rack power flow—from high-voltage conversion to control and protection—customers can optimize system performance end-to-end.

Infineon complements IBC offering with advanced power path protection solutions that ensure controlled startup, stable operation, and robust fault handling in high-density AI server racks.

They protect IBC and other critical components within computing trays during power ramp-up, improving system reliability and preventing disruptions in demanding, high-density AI server environments.

With downtime costs reaching up to $5 million per hour, reliabile hotswap capability is critical. Infineon's portoflio -  including  hot-swap controllers, linear MOSFETs, and eFuses - enables safe server blade insertion and removal, maintaining continuous operation.

For MV systems, XDP700 series with linear FETs provide accurate monitoring and protection. For HVDC systems, the HV hot-swap reference solutions based on SiC JFET technology deliver robust performance, effectively handling high inrush currents under transient conditions to ensure reliable system protection. 

Toegther, they improve system uptime, reliability, and protection. Combined with Infineon’s IBC solutions, they enable stable, long-term operation for conventional as well as AI servers, helping optimize total cost of ownership (TCO).

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