Dear valued customer,

We appreciate your interest in our presentation cases, which showcase the key features and benefits of our current and brand new power modules portfolio. Our devices are designed to cater to a wide range of applications and industries, and we are excited to share the highlights of our packages with you. Our power modules portfolio is comprised of a broad range of products that offer exceptional performance, efficiency, and reliability.

 

Some of the key highlights of our packages include:

  • High-performance devices that enable efficient power management and conversion
  • Compact and space-saving designs that facilitate easy integration into various applications
  • Advanced features and functionalities that enhance system reliability and flexibility
  • Compliance with industry standards (additionally AQG324 for Easy modules) and regulations, ensuring seamless integration and compatibility
More about our IGBT modules More about our MOSFET modules

The Easy family - a flexible and scalable powermodule solution

We offer the broadest base-plate-less package portfolio with 12 mm height. The flexible pin grid system is a perfect fit for customizing layout and pinout.

Advantages of Easy B-Series:

  • No baseplate, which makes the Easy module a perfect fit for multiple applications
  • A flexible pin grid enables easy PCB designs and supports special application requirements
  • Very solid and reliable pin rivet connection including our PressFIT pin technology
  • 12 mm height to harmonize design and ease assembly effort

Advantages of Easy C-Series:

  • High power density for compact design for smaller, more efficient systems
  • Simple integration and standardized pin-out and footprint
  • High-quality components and rigorous testing for maximum reliability
  • Low inductive designs reduced EMI and easier regulatory compliance
More about our Easy families
Family Overview Packages Easy Modules
Family Overview Packages Easy Modules
Family Overview Packages Easy Modules

The Econo family - best choice for a scalable module solution in a baseplate package

We offer a broad baseplate portfolio with high flexibility on pin positions and topologies with proven CoolSiC™ MOSFET and IGBT technology available.

Advantages of Econo Modules:

  • Integration: On-board temperature and current measurement via NTC and shunt, pre-applied thermal interface material (TIM), for lower handling costs and extended lifetime
  • Simplicity: PressFIT for main as well as auxiliary terminals to reduce mounting effort
  • One fits all: Numerous topologies, voltages (600 V-1700 V) and currents (for Econo2, 3 and 4: 15 A-200 A; for EconoDUAL™ 3: 150 A- 900 A) serve several applications for platform strategies

The available configurations in the low-power arena are the EconoPIM™ 2 and 3. In the medium power range we present the EconoDUAL™ 3 and the EconoPACK™ 4. The EconoDUAL™ 3 package is also available with CoolSiC™ MOSFET. Additionally we offer the EconoDUAL™ 3 with wave structure on the base plate for direct liquid-cooled heat sinks which provides up to 6x higher lifetime.

More about our Econo families
Family Overview Packages Econo Modules
Family Overview Packages Econo Modules
Family Overview Packages Econo Modules

The 62mm power modules - our mature housing technology

A full product portfolio of IGBT and CoolSiC™ MOSFET modules over many voltage classes and current ratings with proven IGBT7 and M1H technology.

Advantages of 62mm:

  • Well established module design with isolated baseplate allows screw connection of main terminals
  • Pre-applied thermal interface material (TIM) provides lowest thermal resistance to achieve Rth improvement for extended lifetime
  • „Best-in-Class“ module with highest available current capability and 175°C continuous operation temperature for leading IGBT7 chip technology
  • Improved Rds(on), gate oxide reliability and power density for M1H silicon carbide modules, also available in common source topology 
More about our 62mm family
62mm
62mm
62mm