Overview

With the ongoing increase of power densities in power electronics, the thermal interface between the power module and heatsink becomes a larger challenge. A TIM developed for and pre-applied to our power modules outperforms the general-purpose materials available. TIM not only provides the lowest thermal resistance, it also fulfills the highest quality standards given for power modules to achieve the longest lifetime & highest system reliability.

Key features
  • Provides lowest thermal resistance
  • Fulfills highest quality standards
  • Highest system reliability
  • Reproducible thermal performance

Products

About

EasyPACK™  with TIM

The Infineon Easy family offers scalable and customizable power modules covering the full power range up to several hundred kilowatts in various voltage classes (i.e. 1200 V). Designed for a wide range of applications such as EV charging, energy storage, UPS, data centers, motor control, HVAC, and renewable energy, these modules deliver superior performance and reliability at system level.

The portfolio supports both silicon (Si) and silicon carbide (SiC), featuring the latest chip technologies including TRENCHSTOP™ IGBT8, CoolMOS™, and CoolSiC™ MOSFET G2. Efficient PressFIT and High Current PressFIT pins further simplify mounting and integration.

For optimized thermal management, Easy modules are offered with pre-applied thermal interface material. The latest phase-change material (PCM) TIM2.0, improves RthJH on module level, enabling higher output power. Thanks to identical mechanical dimensions and integration, switching to TIM 2.0 is a true plug & play experience - no redesign needed. 

More about Easy Modules with TIM

EconoPACK™ and EconoPIM™ with TIM

EconoPACK™ and EconoPIM™ modules feature a cost-effective compact design and allow for simplified and reliable mounting. It is now available with thermal interface material pre-applied.

Get more information about EconoPACK™ with TIM
Get more information about EconoPIM™ with TIM

EconoPACK™ 4 and EconoPACK™+ D-series with TIM

The EconoPACK™ 4 is our well-known solution for applications where robustness and reliability matter. Now the best becomes even better: EconoPACK™ 4 is now available with thermal interface material pre-applied.

The innovative EconoPACK™+ D-series takes care of reliable and solderless press-in contacts with PressFIT auxiliary terminals. The PressFIT contacts also provide the flexibility for a solder process, if required. The D-series is focused on a rugged and robust module design by injected-molded control and power terminals and ultrasonic-welded power terminals. Now available with thermal interface material pre-applied.

Discover more about the EconoPACK™ 4 with TIM
Make the next step with the EconoPACK™+ D-series

EconoDUAL™3 and 62 mm IGBT modules with TIM

With the EconoDUAL™3 family, we support the complete current ranges from 100 A up to 600A at 600 V / 650 V / 1200 V / 1700 V. Excellent mechanical robustness, power cycling capability, the option of PressFIT pins as well as the availability of TIM makes a reliable, cost-effective solution for applications in drives, CAV, wind turbines, solar, and hybrid vehicles.

Flexibility, optimal electrical performance and highest reliability - these are the keywords for a successful inverter layout. 62 mm modules with pre-applied thermal interface material are the right choice for your design.

Find out more about the EconoDUAL™3 IGBT family
Discover our wide 62 mm IGBT modules portfolio

PrimePACK™, 50/60/70 mm eco block, and power block modules with TIM

Our PrimePACK™ IGBT Modules with TIM increase system reliability and optimize thermal management. In addition, handling in mounting and maintenance can be improved. This reduces process time in manufacturing.

The power block modules in 50, 60, and 70 mm contain thyristors and diodes in the voltage range of 1200 V to 4400 V and a current range of 240 A up to 1100 A. Now Infineon offers these modules with thermal interface material pre-applied to simplify mounting (For details about modules with TIM, please contact your local sales office).

More about our PrimePACK™ modules
Find out more about our Thyristor / Diode modules

50 mm solder bond modules and IHM B modules with TIM

With the release of the new 50 mm modules, we extended our product portfolio of thyristor/diode modules in solder bond technology. Now Infineon Technologies Bipolar offers these modules with thermal interface material pre-applied to simplify mounting.

Our IHM-B IGBT Modules with TIM increases system reliability and optimize thermal management. In addition, handling in mounting and maintenance can be improved. This reduces process time in manufacturing.

Find out more about our solder bond modules
Find out more about IHM B modules

EasyPACK™  with TIM

The Infineon Easy family offers scalable and customizable power modules covering the full power range up to several hundred kilowatts in various voltage classes (i.e. 1200 V). Designed for a wide range of applications such as EV charging, energy storage, UPS, data centers, motor control, HVAC, and renewable energy, these modules deliver superior performance and reliability at system level.

The portfolio supports both silicon (Si) and silicon carbide (SiC), featuring the latest chip technologies including TRENCHSTOP™ IGBT8, CoolMOS™, and CoolSiC™ MOSFET G2. Efficient PressFIT and High Current PressFIT pins further simplify mounting and integration.

For optimized thermal management, Easy modules are offered with pre-applied thermal interface material. The latest phase-change material (PCM) TIM2.0, improves RthJH on module level, enabling higher output power. Thanks to identical mechanical dimensions and integration, switching to TIM 2.0 is a true plug & play experience - no redesign needed. 

More about Easy Modules with TIM

EconoPACK™ and EconoPIM™ with TIM

EconoPACK™ and EconoPIM™ modules feature a cost-effective compact design and allow for simplified and reliable mounting. It is now available with thermal interface material pre-applied.

Get more information about EconoPACK™ with TIM
Get more information about EconoPIM™ with TIM

EconoPACK™ 4 and EconoPACK™+ D-series with TIM

The EconoPACK™ 4 is our well-known solution for applications where robustness and reliability matter. Now the best becomes even better: EconoPACK™ 4 is now available with thermal interface material pre-applied.

The innovative EconoPACK™+ D-series takes care of reliable and solderless press-in contacts with PressFIT auxiliary terminals. The PressFIT contacts also provide the flexibility for a solder process, if required. The D-series is focused on a rugged and robust module design by injected-molded control and power terminals and ultrasonic-welded power terminals. Now available with thermal interface material pre-applied.

Discover more about the EconoPACK™ 4 with TIM
Make the next step with the EconoPACK™+ D-series

EconoDUAL™3 and 62 mm IGBT modules with TIM

With the EconoDUAL™3 family, we support the complete current ranges from 100 A up to 600A at 600 V / 650 V / 1200 V / 1700 V. Excellent mechanical robustness, power cycling capability, the option of PressFIT pins as well as the availability of TIM makes a reliable, cost-effective solution for applications in drives, CAV, wind turbines, solar, and hybrid vehicles.

Flexibility, optimal electrical performance and highest reliability - these are the keywords for a successful inverter layout. 62 mm modules with pre-applied thermal interface material are the right choice for your design.

Find out more about the EconoDUAL™3 IGBT family
Discover our wide 62 mm IGBT modules portfolio

PrimePACK™, 50/60/70 mm eco block, and power block modules with TIM

Our PrimePACK™ IGBT Modules with TIM increase system reliability and optimize thermal management. In addition, handling in mounting and maintenance can be improved. This reduces process time in manufacturing.

The power block modules in 50, 60, and 70 mm contain thyristors and diodes in the voltage range of 1200 V to 4400 V and a current range of 240 A up to 1100 A. Now Infineon offers these modules with thermal interface material pre-applied to simplify mounting (For details about modules with TIM, please contact your local sales office).

More about our PrimePACK™ modules
Find out more about our Thyristor / Diode modules

50 mm solder bond modules and IHM B modules with TIM

With the release of the new 50 mm modules, we extended our product portfolio of thyristor/diode modules in solder bond technology. Now Infineon Technologies Bipolar offers these modules with thermal interface material pre-applied to simplify mounting.

Our IHM-B IGBT Modules with TIM increases system reliability and optimize thermal management. In addition, handling in mounting and maintenance can be improved. This reduces process time in manufacturing.

Find out more about our solder bond modules
Find out more about IHM B modules
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