CY7C1059H30-10ZSXIT
Active and preferred
RoHS Compliant
Lead-free

CY7C1059H30-10ZSXIT

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CY7C1059H30-10ZSXIT
CY7C1059H30-10ZSXIT

Product details

  • Density
    8 MBit
  • Family
    FAST SRAM
  • Interfaces
    Parallel
  • Lead Ball Finish
    Ni/Pd/Au
  • Operating Temperature range
    -40 °C to 85 °C
  • Operating Voltage range
    2.2 V to 3.6 V
  • Organization (X x Y)
    1M x 8
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2033
  • Qualification
    Industrial
OPN
CY7C1059H30-10ZSXIT
Product Status active and preferred
Infineon Package
Package Name TSOP-II-44 (51-85087)
Packing Size 1000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
Package Name TSOP-II-44 (51-85087)
Packing Size 1000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
CY7C1059H30-10ZSXIT is an 8-Mbit (1M × 8) asynchronous CMOS SRAM with embedded ECC for single-bit error correction. It operates from 2.2 V to 3.6 V over -40°C to 85°C and offers 10 ns address access (tAA). Dual chip enables (CE1/CE2) control read/write via OE and WE, and I/Os tri-state when deselected. Typical ICC is 90 mA at 100 MHz with ISB2 20 mA standby. It is offered in a Pb-free 44-pin TSOP II (ZS) package.

Features

  • 8-Mbit SRAM (1M words x 8)
  • Embedded ECC, single-bit correct
  • 2.2 V to 3.6 V VCC range
  • 1.0 V data retention mode
  • tAA 10 ns access time
  • 10 ns read cycle time (tRC)
  • 10 ns write cycle time (tWC)
  • OE to data valid 5 ns (tDOE)
  • Dual chip enable (CE1, CE2)
  • Tri-state outputs (OE/CE/WE)
  • TTL-compatible I/O thresholds
  • ERR output flags 1-bit ECC event

Benefits

  • ECC corrects 1-bit memory errors
  • ERR pin enables fault monitoring
  • 10 ns cycles support fast buses
  • 5 ns OE latency speeds reads
  • 2.2-3.6 V fits 3.3 V rails
  • 1.0 V retention saves backup power
  • Dual CE eases memory chip select
  • Tri-state I/Os simplify bus sharing
  • TTL I/O simplifies interfacing logic
  • ±1 µA I/O leakage reduces loss
  • CE power-down cuts standby current
  • High-speed SRAM cuts wait states

Applications

Documents

Design resources

Developer community

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