OptiMOS™ TOLx package family

Addressing high-power (TOLL), better TCoB robustness (TOLG), superior thermal performance (TOLT)

TOLL (TO-Leadless)

infographic-toll-package-v01-00.png

Optimized for high-power applications
infographic-toll-package-v01-00.png

Optimized for high-power applications
infographic-toll-package-v01-00.png

Optimized for high-power applications

TO-Leadless is optimized to handle currents of up to 300 A, increasing power density with a substantial reduction in footprint. A footprint reduction of 30 percent compared to D²PAK, together with a height reduction of 50 percent, results in an overall space saving of 60 percent enabling much more compact designs.

Find industrial OptiMOS™ TOLL products
Find automotive OptiMOS™ TOLL products

TOLG (TO-Leaded with gullwing)

infographic tolg package graphic

Optimized for better thermal cycling on board (TCoB) robustness
infographic tolg package graphic

Optimized for better thermal cycling on board (TCoB) robustness
infographic tolg package graphic

Optimized for better thermal cycling on board (TCoB) robustness

TOLG package offers a compatible footprint to the TO-Leadless package with the additional feature of gullwing leads resulting in 2x higher TCoB performances compared to TO-Leadless. This package is excellent in performance on aluminum insulated metal substrate boards (Al-IMS).

Find industrial OptiMOS™ TOLG products
Find automotive OptiMOS™ TOLG products

TOLT (TO-Leaded Top-side cooling)

infographic tolt package graphic

Optimized for superior thermal performance
infographic tolt package graphic

Optimized for superior thermal performance
infographic tolt package graphic

Optimized for superior thermal performance

TOLT is the TO-Leaded top-side cooling package within the TOLx family. With top-side cooling, the drain is exposed at the surface of the package allowing for 95 percent of the heat to be dissipated directly to the heatsink, achieving 20 percent better RthJA and 50 percent improved RthJC compared to the TOLL package. With bottom-side cooling packages, like the TOLL or the D²PAK, the heat is dissipated via the PCB to the heatsink resulting in high power losses.

Find industrial OptiMOS™ TOLT products
Find automotive OptiMOS™ TOLT products

Features, Benefits, and Applications

The TOLx package family - Infineon's power MOSFETs in TOLL, TOLG, and TOLT

Key features
  • Low RDS(on)
  • High current rating
  • Lower ringing and voltage overshoot compared to D²PAK
Key benefits
  • Reduction in conduction losses
  • High power density
  • System efficiency
  • Extended liftime 
  • High efficiency by lower switching losses and lower EMI
product visual package toll hsof v01 00
product visual package toll hsof v01 00
product visual package toll hsof v01 00
TOLL package
  • Key feature: 60% board space reduction compared to D²PAK 7-pin
  • Key benefit: high power density
product visual package tolg hsog v01 00
product visual package tolg hsog v01 00
product visual package tolg hsog v01 00
TOLG package
  • Key feature: 60% board space reduction compared to D²PAK 7-pin
  • Key benefit: high power density and superior thermal cycling on board (TCoB) performance
product visual package hdsop 16-tolt v01 00
product visual package hdsop 16-tolt v01 00
product visual package hdsop 16-tolt v01 00
TOLT package
  • Key feature: top-side cooling negative stand-off
  • Key benefit: excellent thermal performance minmizing thermal resistance to heatsink

Cooling concept

Cooling concept of TO-Leadless and TO-Leaded with gullwing

Infographic with a comparison of TOLL and TOLG cooling concept with gullwing

Comparing TOLL & TOLG Cooling concept of TO-Leadless and TO-Leaded with gullwing
Infographic with a comparison of TOLL and TOLG cooling concept with gullwing

Comparing TOLL & TOLG Cooling concept of TO-Leadless and TO-Leaded with gullwing
Infographic with a comparison of TOLL and TOLG cooling concept with gullwing

Comparing TOLL & TOLG Cooling concept of TO-Leadless and TO-Leaded with gullwing

With TOLL/TOLG board mounting, the heat is dissipated through the PCB to the heatsink. Due to the PCB thermal resistance, power losses occur. TOLL is recommended for FR4 and CU-based IMS boards and TOLG is recommended for Al-IMS boards

Find OptiMOS™ power MOSFET in TOLL products
Find OptiMOS™ power MOSFET in TOLG products
Infographic with a comparison of TOLL and TOLG cooling concept with top-side cooling

Cooling concept of TO-Leadless and TO-Leaded top-side cooling
Infographic with a comparison of TOLL and TOLG cooling concept with top-side cooling

Cooling concept of TO-Leadless and TO-Leaded top-side cooling
Infographic with a comparison of TOLL and TOLG cooling concept with top-side cooling

Cooling concept of TO-Leadless and TO-Leaded top-side cooling

With top-side cooling setup, the drain pad is exposed on the top of the package allowing the majority of the heat to be dissipated into a top-mounted heatsink. 

This pulls heat away from the PCB resulting in at least 20 percent better RthJA compared to standard over-molded TOLL.

Find OptiMOS™ power MOSFET in TOLL products
Find OptiMOS™ power MOSFET in TOLT products

TOLx TCoB

Thermal Cycling on Board Performance

graph-tolx-tcob-performance-v01-00.png
graph-tolx-tcob-performance-v01-00.png
graph-tolx-tcob-performance-v01-00.png

Trainings & downloads

Trainings

Choosing the right power MOSFET package for your application

In this webinar, Infineon's expert, Francesca Pastorelli, explains how to select the right power MOSFET package for your design. Participants learn how to overcome challenges like thermal behavior, high current, and high power density in SMPS, BMS, and motor drive applications using Infineon’s newly released packages for power MOSFETs from 20 V to 300 V.

Demoboards

Browse related demo- and evaluation boards

evaluation board bdps dd tolg v01 00
evaluation board bdps dd tolg v01 00
evaluation board bdps dd tolg v01 00

TOLG power board for bidirection battery disconnection

Go to EVAL_BDPS_DD_TOLG
evaluation board bdps dd toll v01 00
evaluation board bdps dd toll v01 00
evaluation board bdps dd toll v01 00

TOLL power board for bidirection battery disconnection

Go to EVAL_BDPS_DD_TOLL
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.

TOLG power board for low voltage drives

Go to KIT_LGPWR_BOM013

Features, Benefits, and Applications

The TOLx package family - Infineon's power MOSFETs in TOLL, TOLG, and TOLT

Key features
  • Low RDS(on)
  • High current rating
  • Lower ringing and voltage overshoot compared to D²PAK
Key benefits
  • Reduction in conduction losses
  • High power density
  • System efficiency
  • Extended liftime 
  • High efficiency by lower switching losses and lower EMI
product visual package toll hsof v01 00
product visual package toll hsof v01 00
product visual package toll hsof v01 00
TOLL package
  • Key feature: 60% board space reduction compared to D²PAK 7-pin
  • Key benefit: high power density
product visual package tolg hsog v01 00
product visual package tolg hsog v01 00
product visual package tolg hsog v01 00
TOLG package
  • Key feature: 60% board space reduction compared to D²PAK 7-pin
  • Key benefit: high power density and superior thermal cycling on board (TCoB) performance
product visual package hdsop 16-tolt v01 00
product visual package hdsop 16-tolt v01 00
product visual package hdsop 16-tolt v01 00
TOLT package
  • Key feature: top-side cooling negative stand-off
  • Key benefit: excellent thermal performance minmizing thermal resistance to heatsink

Cooling concept

Cooling concept of TO-Leadless and TO-Leaded with gullwing

Infographic with a comparison of TOLL and TOLG cooling concept with gullwing

Comparing TOLL & TOLG Cooling concept of TO-Leadless and TO-Leaded with gullwing
Infographic with a comparison of TOLL and TOLG cooling concept with gullwing

Comparing TOLL & TOLG Cooling concept of TO-Leadless and TO-Leaded with gullwing
Infographic with a comparison of TOLL and TOLG cooling concept with gullwing

Comparing TOLL & TOLG Cooling concept of TO-Leadless and TO-Leaded with gullwing

With TOLL/TOLG board mounting, the heat is dissipated through the PCB to the heatsink. Due to the PCB thermal resistance, power losses occur. TOLL is recommended for FR4 and CU-based IMS boards and TOLG is recommended for Al-IMS boards

Find OptiMOS™ power MOSFET in TOLL products
Find OptiMOS™ power MOSFET in TOLG products
Infographic with a comparison of TOLL and TOLG cooling concept with top-side cooling

Cooling concept of TO-Leadless and TO-Leaded top-side cooling
Infographic with a comparison of TOLL and TOLG cooling concept with top-side cooling

Cooling concept of TO-Leadless and TO-Leaded top-side cooling
Infographic with a comparison of TOLL and TOLG cooling concept with top-side cooling

Cooling concept of TO-Leadless and TO-Leaded top-side cooling

With top-side cooling setup, the drain pad is exposed on the top of the package allowing the majority of the heat to be dissipated into a top-mounted heatsink. 

This pulls heat away from the PCB resulting in at least 20 percent better RthJA compared to standard over-molded TOLL.

Find OptiMOS™ power MOSFET in TOLL products
Find OptiMOS™ power MOSFET in TOLT products

Trainings & downloads

Trainings

Choosing the right power MOSFET package for your application

In this webinar, Infineon's expert, Francesca Pastorelli, explains how to select the right power MOSFET package for your design. Participants learn how to overcome challenges like thermal behavior, high current, and high power density in SMPS, BMS, and motor drive applications using Infineon’s newly released packages for power MOSFETs from 20 V to 300 V.

Demoboards

Browse related demo- and evaluation boards

evaluation board bdps dd tolg v01 00
evaluation board bdps dd tolg v01 00
evaluation board bdps dd tolg v01 00

TOLG power board for bidirection battery disconnection

Go to EVAL_BDPS_DD_TOLG
evaluation board bdps dd toll v01 00
evaluation board bdps dd toll v01 00
evaluation board bdps dd toll v01 00

TOLL power board for bidirection battery disconnection

Go to EVAL_BDPS_DD_TOLL
.
.
.

TOLG power board for low voltage drives

Go to KIT_LGPWR_BOM013