TO-leaded (TOLT) top-side cooling

Top-side cooling package for superior thermal performance

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Overview

Infineon OptiMOS™ power MOSFET family’s high-performance package offerings include the TO-Leaded Top-side cooling (TOLT) package. The TOLT package offers the same high current, low-profile benefits as the TOLL package with the additional advantage of top-side cooling for optimum thermal performance.

Key Features

  • Low RDS(on)
  • High current rating >300 A
  • High power density
  • Sn-free exposed pad
  • Low thermal resistance to heatsink

Products

About

High power density designs with high current rating > 300 A

The innovative TOLT package combined with the key features of OptiMOS™ power MOSFET technology enables best-in-class products. The family is available with the latest OptiMOS™ 5 or OptiMOS™ 6 power MOSFET technologies. The portfolio includes MOSFETs in 60 V, 80 V, 100 V, and 150 V ranges, and feature high-current rating > 300 A for high power density designs.

Benefits of TOLT package

With top-side cooling, the drain is exposed at the surface of the package allowing for 95 percent of the heat to be dissipated directly to the heatsink, achieving 20 percent better RthJA and 50 percent improved RthJC compared to the TOLL package. With bottom-side cooling packages, like the TOLL or the D²PAK, the heat is dissipated via the PCB to the heatsink resulting in high power losses.

TOLx products - TOLL, TOLT, and TOLG

Infineon's TOLx family of high current, high power density packages – TO-Leadless (TOLL), TO-Leaded Top-Side Cooling (TOLT), and TO-Leaded with Gullwing leads (TOLG) – addresses different requirements. The TOLL package features high power density, TOLG offers superior thermal cycling on board (TCoB), while TOLT offers improved thermal performance with minimal thermal resistance to the heatsink.

TOLx family of packages
Top cooling enables advanced thermal performance with less power loss

The TOLT package is constructed with its lead frame flipped to position exposed metal on the top side; the package contains multiple gullwing leads on each side for drain and source connections that carry high current. In addition, the exposed pad is tin-free.

With a flipped lead frame, heat passes from the exposed metal top side directly to the heatsink through the insulating material. In the case of a bottom-side cooling package like TOLL, the heat is dissipated via the PCB to the heatsink, and power losses occur due to PCB thermal resistance. The new TOLT package achieves 20 percent better RthJA, and 50 percent improved RthJC.

High power density designs with high current rating > 300 A

The innovative TOLT package combined with the key features of OptiMOS™ power MOSFET technology enables best-in-class products. The family is available with the latest OptiMOS™ 5 or OptiMOS™ 6 power MOSFET technologies. The portfolio includes MOSFETs in 60 V, 80 V, 100 V, and 150 V ranges, and feature high-current rating > 300 A for high power density designs.

Benefits of TOLT package

With top-side cooling, the drain is exposed at the surface of the package allowing for 95 percent of the heat to be dissipated directly to the heatsink, achieving 20 percent better RthJA and 50 percent improved RthJC compared to the TOLL package. With bottom-side cooling packages, like the TOLL or the D²PAK, the heat is dissipated via the PCB to the heatsink resulting in high power losses.

TOLx products - TOLL, TOLT, and TOLG

Infineon's TOLx family of high current, high power density packages – TO-Leadless (TOLL), TO-Leaded Top-Side Cooling (TOLT), and TO-Leaded with Gullwing leads (TOLG) – addresses different requirements. The TOLL package features high power density, TOLG offers superior thermal cycling on board (TCoB), while TOLT offers improved thermal performance with minimal thermal resistance to the heatsink.

TOLx family of packages

Top cooling enables advanced thermal performance with less power loss

The TOLT package is constructed with its lead frame flipped to position exposed metal on the top side; the package contains multiple gullwing leads on each side for drain and source connections that carry high current. In addition, the exposed pad is tin-free.

With a flipped lead frame, heat passes from the exposed metal top side directly to the heatsink through the insulating material. In the case of a bottom-side cooling package like TOLL, the heat is dissipated via the PCB to the heatsink, and power losses occur due to PCB thermal resistance. The new TOLT package achieves 20 percent better RthJA, and 50 percent improved RthJC.

Documents

Documents

Design resources

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community ", "labelEn" : "Ask the community " }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions ", "labelEn" : "View all discussions " } ] }