Semiconductors have revolutionized our day-to-day lives, paving the way for ground-breaking innovations as diverse as smart phones, electric cars and renewable energy. Infineon Technologies, continuing in the tradition of Siemens, plays a defining role in advancing today’s semiconductor technologies. Join us on a journey through our company history. It all started out in a castle in Upper Franconia.
In 1946, the Siemens Executive Board establishes a lab dedicated to basic semiconductor research at a small castle in the village of Pretzfeld. In the summer of 1946, a small group of researchers starts work there, laying the foundations of Infineon Technologies as we know it today. The group is headed by Eberhard Spenke and includes Walter Schottky as a scientific consultant – two pioneers in semiconductor research.
Eric Lidow and his father, Leon Lidow, found International Rectifier in August 1947 with just six employees at the facility in Inglewood, CA.
IR introduces selenium plates 50% larger than existing plates.
IR introduces selenium photo cells and selenium diodes and selenium cartridge rectifiers.
IR installs new process techniques based on single crystal P-N junction technology that allows rectifiers to be made smaller and withstand greater temperature extremes.
In 1951, Heinrich Welker registers a patent for DE970420B, an electronic semiconductor device that forms the basis of all III-V semiconductors. This class of semiconductors includes gallium and arsenide and is used in a wide range of components, including light emitting diodes (LEDs). Today, lighting remains a key application area for semiconductor modules from Infineon.
IR introduces selenium stack rectifiers for battery charging. IR relocates from original facility on Victoria St. In Inglewood to1521 Grand Ave. in El Segundo.
April 1, 1951, an internal memo announces Siemens’ plans to open a semiconductor fabrication facility. In the letter, Ernst von Siemens writes: “semiconductors such as transistors, thermistors, varistors and diodes (crystal diodes) are becoming increasingly important in communications engineering. This is an extremely important area and it is therefore vital that we establish a strong presence across the entire field.” Today, Infineon has a dozen fabrication sites worldwide. Half of these are located in Europe.
IR introduces line of sub-miniature selenium diodes for bias supplies, sensitive relays, hearing aids and many space-restricted applications.
IR begins production of selenium rectifiers for the new color TV. New products include germanium diodes and world’s largest single selenium rectifier stack.
The researchers at Castle Pretzfeld develop a method for producing ultrapure silicon for use in semiconductors. This is one of the lab’s most important developments. Sixty years later, around 80 percent of the world’s silicon is still produced using this method.
IR introduces ‘Sun Battery’ self-generating selenium photo electric cell. IR offers germanium rectifiers for use in atomic energy installations, chemical manufacturing, anodizing and electroplating.
IR offers tiny silicon diodes. IR opens new facility at 201 Nevada St. El Segundo to produce selenium rectifiers for radio and television industry. IR offers selenium cartridge rectifier for use in Geiger counters.
IR introduces sub-miniature selenium diodes for applications that must withstand severe environmental conditions. IR is the first company to introduce space-saving silicon cartridge rectifier.
IR introduces Unistac TV 500 silicon rectifier, a universal replacement for selenium stack rectifier. International Rectifier Corp, Japan Ltd. founded. Tube base mounted silicon rectifiers replace vacuum tubes.
IR's selenium photoelectric cells used in Bell & Howell 8mm Electric Eye movie camera. IR begins production of zener diodes and silicon solar cells. IR goes public in US and continues global expansion.
In 1959, Siemens opens its Regensburg Wernerwerk site at the disused airfield of the former Messerschmidt aircraft manufacturing company. Siemens starts producing ceramic capacitors at this site in 1960. Today, around 2,000 people work for Infineon at Regensburg. Development and production activities include frontend fabrication for 200-mm wafers, backend operations for sensors, chip embedding and chipcard and security solutions, plus a wide range of other development functions such as global package development.
IR introduces the first silicon controlled rectifier (SCR) called the “Thyrode” thyristor. IR opens pilot plant at 200 Center St. El Segundo for manufacture of encapsulated miniature silicon diodes. IR forms joint venture with N.V. Diode in the Netherlands. Global expansion includes facilities in Copenhagen, Geneva, London, Milan and Paris.
IR introduces world’s first solar-powered car. Company’s securities listed (IRF) on New York and Pacific stock exchanges. New 80,000 sq. ft. facility at Kansas St, El Segundo, begins production.
Operations begin at IR Turin, a joint venture with Fiat. Dallons manufactures the ground support equipment used to monitor Alan Shepard’s heart during his historic space flight. IR purchases Honolulu’s Industrial Research laboratories. IR acquires Xaloy Inc., the world's largest manufacturer of bimetallic extruder cylinders for industrial equipment.
IR establishes Educational Products for student science kits. IR introduces new epitaxial process for producing industry's most stable high voltage SCRs. IR supplies 12F20 12-amp diode for Sylvania's Sun Gun floodlight.
The researchers manage to optimize the transistor fabrication process as early as 1959. These improvements significantly increase the transition frequency of transistors. In 1963, the company Grundig installs these mesa transistors in their televisions for the first time. The new transistors boost picture quality dramatically as they have much lower noise figures than previous models.
Radiation-resistant solar cells for space applications introduced. IR launches light-actuated switches for computers and control systems.
Plant completed and equipment installed in IR India (New Delhi). IR-owned Dallons loans 20th Century Fox Studios sophisticated electronic equipment for use in the movie ‘Fantastic Voyage’.
IR begins manufacture of selenium rectifiers in India as Usha Rectifier. IRGB enlarged to accommodate new product lines. IR sells its interest in LESSEL.
IR employs more than 2,000 employees worldwide. IR begins operations at IR Canada in Scarborough, Ontario. IR begins manufacture of pre-engineered silicon, SCR and hybrid modular assemblies that combine heat sink and rectifier components.
IR establishes Rachelle Laboratories Italia, S.p.A.
IR supplies SCRs for new electric car prototypes manufactured by Gulton Industries and American Motorsdevelops experimental electric car. IR establishes Progress Laboratories, Inc. IR acquires Crydom Controls Division.
In 1966, Siemens & Halske, Siemens & Schuckert and Siemens-Reininger-Werke are merged to form Siemens AG. The Bauelemente (components) division is one of the new business areas created as a result of internal reorganization. From an organizational perspective, it is the forerunner of Infineon Technologies.
IR becomes first Japanese/American joint venture to be listed on Tokyo stock exchange. IR supplies zener voltage regulators for Apollo 11 Saturn V Booster.
The component fabrication facility in Villach starts manufacturing glass diodes in 1970. Today, the Villach site encompasses research, development and frontend fabrication – mainly of chips targeted at industrial and automotive electronics applications. The Villach site is also responsible for the international business development of five Infineon product lines focused on energy efficiency and electric mobility. Over the decades, Infineon Technologies Austria AG has become a leading light in Austria. Today, around 3,100 employees from around 60 different nations work at our sites in Villach, Klagenfurt, Graz, Linz and Vienna.
Crydom Controls Division moves from Santa Ana to 1521 E. Grand Ave in El Segundo, CA.
In 1971, Siemens launches the first red LEDs. The diodes emit light with a wavelength of 660 nanometers. The LEDs quickly replace bulbs in many applications including mode displays in consumer electronics. Red becomes the standard color for standby modes. The advent of LEDs significantly cuts electricity consumption. Today, almost two-thirds of all Infineon products help manufacturers use energy more efficiently.
With the PACE-Pak for DC drives and power supplies, IR becomes the first company to introduce the power module concept. IR Sells Dallons to Ohio Nuclear, Inc., a subsidiary of BBC Industries. IR begins operations in Newry, Northern Ireland manufacturing high voltage silicon cartridge rectifiers for color television sets and X-ray machines. IR introduces first commercially viable photo-isolated solid state power relays.
IR introduces first commercially viable power Schottky device for use in computer power supplies and telephone switching equipment.
IR begins operations at Rectificadores Internacionales (IR Mexico) in March.
The first remote controls for televisions used ultrasound. They were prone to interference and easy to manipulate. In 1974, Siemens unveils the first infrared transmission system. In 1976, Grundig becomes the first television manufacturer worldwide to use this technology in its remote controls.
N.V. Diode becomes B.V. Diode for manufacture of semiconductors and rectifier stacks. IR enters the most sophisticated segment of the transistor market with bipolar and Darlington transistors using glass passivation.
IR supplies SCRs and diodes for production welding equipment used to fabricate off-shore drilling platforms. IR supplies rectifiers for U.S. Postal Service battery powered delivery vans. IR power transistors appear in ignition systems to conserve fuel and eliminate costly tune-ups.
IR acquires full ownership of its joint venture European semiconductor companies. IR introduces epitaxial-based high energy transistors. IR's HEXFET power MOSFET opens tremendous opportunities for government and space applications thanks to power handling and reliability.
The first of several new series of high-power, temperature SCRs introduced to meet new industry standards for high extra overload current handing capability in motor control systems. European operations now totally owned by IR.
IR supplies rectifiers and SCRs for Lockheed's L-1011 aircraft. IR introduces planar MOSFET technology. IR is the first in industry to establish a metal oxide semiconductor (MOS) lab to develop the world's highest power rated field effect transistor (FET).
Jenö Tihanyi lays one of the cornerstones for Infineon’s success by developing the SIPMOS™ transistor. SIPMOS™ forms the basis of all Infineon’s power MOS transistors today (e.g. PROFET™, HITFET™ and CoolMOS™). These transistors are used in devices such as servers and adapters, where they help cut energy consumption by reducing the amount of heat generated.
Alex Lidow and Tom Herman of IR invent the HEXFET®, the first power MOSFET to employ a six-sided cell structure, creating the MOS power transistor industry. IR breaks ground for HEXFET wafer fab at 330 Kansas St. in El Segundo.
IR expands line of Schottky rectifiers with 100-volt devices. IR offers 1000A/1800V inverter thyristors for energy-efficient AC motor drives.
New HEXFET manufacturing facility opens at 330 Kansas St. In El Segundo, CA. Xaloy Metallurgical business segment sold.
IR intensifies its research and development of high power thyristor.
IR granted broad, fundamental patents on its power MOSFET technology. Crydom Controls Division introduces the ChipSwitch power IC, its first power interface circuit (PIC) for use in small lamps, solenoids, valves and high power motor starters.
Siemens is slow to react to the memory device revolution at the start of the 1980s. To catch up with Japanese manufactures, the company launches its MEGA project in 1984. Siemens starts producing the 1 Mbit DRAM memory from December 1987 on.
IR founder Leon Lidow passes. Crydom Controls Division introduces the Photovoltaic Relay. IR introduces the 10JQ, one of the industry's first and only surface-mount single Schottky rectifiers for use in the Sony Walkman and 8mm movie cameras. Planning for HEXFET America, a highly automated, manufacturing facility dedicated to high-volume, low-cost HEXFET power MOSFET production begins.
Construction begins on 285,000 sq. ft. HEXFET America facility in Temecula, CA. IR Far East sales office opens in November (wholly-owned branch in Japan).
The German federal post office launches the first 400 public telephones to accept phone cards. The chips on the phone cards are based on a secure memory chip from Infineon.
Chips are subject to a number of dangers in their day-to-day lives, including overheating and short circuits. These events can destroy chips and even result in device failure. Infineon’s new chips are so intelligent that they can deactivate themselves if they overheat or are overloaded. Components are being made to increasingly robust standards.
HEXSense FETs introduced. Remaining holdings in IR Japan sold. IR sells Rachelle Labs.
HEXFET America goes into production. Crydom sold to Silicon Power Cube. IR is first manufacturer to offer radiation-resistant (RAD-Hard) MOSFETs. IR introduces first high-voltage power IC.
Southeast Asia sales office opens in Singapore. IR2110 bridge driver introduced. IR purchases Secowest and incorporates with IR Italy.
Small computers are everywhere - hidden in washing machines, bank cards, radios, cars and watches. Everywhere you look, microcontrollers are making sure that these devices work properly. In 1989, Siemens develops and delivers its first 16-bit microcontroller. Today, Infineon continues to successfully develop microcontrollers for automotive and industrial applications.
Sales office opened in Hong Kong and becomes springboard for IR's expansion into Chinese market. IR2100 buck converter launched. IR qualifies MOSFETs for maximum 175°C TJ for ABS application.
IR introduces the IR8400P, the industry's first quad high-side switch.
Cellphones start to really take off with the introduction of the Global System for Mobile Communications (GSM). Siemens develops a GSM chipset comprising four components. By the start of the 1990s, almost all cellphones are equipped with Siemens chips.
IR offers breakthrough IR2121 and IR2125 high-voltage current-limiting Ics. IR opens sales offices in the Czech Republic, Hungary and Poland.
HEXFRED family of ultra-fast soft recovery diodes launched. IR offices open in Korea.
Germany introduces smartcards for citizens and residents insured under the national healthcare system. Infineon’s memory ICs are deployed in every card to store patient information.
IR6000 high-side power switch introduced. 900V IGBTs and ultrafast 500V IGBTs launched. IR announces IRSF3010, its first SmartFET. IR introduces SOT-223 SMT package.
On June 6, 1994, the then Chancellor of Germany Helmut Kohl and CEO of Siemens Heinrich von Pierer lay the cornerstone of a new 200mm fab in Dresden. Located at the former barracks of CIS (Commonwealth of Independent States) forces in the north of Dresden, it was Europe’s largest construction site at the time. The cutting-edge chip production facility is completed in record time, with the new facility ready for equipment in just nine months. 2,000 employees work at the site, using complex fabrication technologies to produce high-quality chips based on 200mm silicon wafers. Since 2011, work has been underway on the world’s first high-volume facility for the production of power semiconductors on 300mm silicon wafers at Dresden.
IR opens representative sales office in Beijing, China and technical support sites in Xi'an and Shanghai. Manufacturing capacity expansion at HEXFET America.
IR's Gen 5 process produces industry's first four-mask power MOSFET. Launch of development and manufacturing at IR Weigwang, IR’s first joint venture in China. IR HEXFET power MOSFETs can be found in EV-1 anti-lock braking and airbag systems.
In 1990, Siemens AG and AEG joined forces to create European Powersemiconductor and Electronics Company (eupec) in Warstein. In 1996, the company becomes a wholly owned subsidiary of Siemens AG. Today, around 1,750 people are employed at the site, which encompasses backend production of IGBT modules and frontend fabrication of bipolar chips. These products are primarily used in renewable energy (wind, photovoltaics, etc.), industrial electrical drive and transport (high-speed trains, underground trains, trams, etc.) applications.
IR introduces the FETKY. Test marketing of ‘plug-and-play’ (IRPT5051) subsystems for industrial, commercial and home appliances begins. Second joint venture in China, IR PERI, begins pilot packaging of IR IGBTs in modules.
The CoolMOS™ transistor is an evolution of the SIPMOS™ transistor. Thanks to an innovative technology, it reduces on-resistance – one of the key performance indicators of a transistor – by a factor of five. This means that less heat is generated when the transistor is in use, something that the product name CoolMOS™ clearly reflects. Devices consume less energy if they remain cool when in use. And more often than not, it’s an Infineon chip that is hard at work keeping temperatures down.
IR Mexico relocates to its new 150,000 sq.ft. facility in Tijuana, Mexico. World's first 1200V control IC (PowIRtrain) introduced. IR introduces WarpSpeed IGBTs.
In 1998, Siemens launches its first generation of 32-bit TriCore™ microcontrollers. To date, Infineon has produced over 100 million of these chips. They can be found in every third car in the world, controlling key components such the engine.
IR chipset first to meet Intel laptop power guidelines. IR builds assembly plant in Wales to meet rapid rise in demand for proprietary modules.
Infineon Technologies AG officially starts business activities on April 1. The new company name is an amalgamation of the English word infinity and the Greek word eon, meaning eternity. The company employs 25,000 people worldwide, 12,000 of whom are based in Germany.
SOIC HEXFET® Power MOSFETs set industry standard for lowest RDS(on).
Infineon shares are traded on the Frankfurt and New York stock exchanges for the first time on March 13, 2000 under the stock symbol IFX. In June of the same year, Infineon is listed on the German stock index (DAX).
Accelerator, a unique motor drive power management architect is launched. IR expands analog business with acquisition of Unisem Inc. Acquisitions of Lambda Advanced Analog Inc. and Magnitude-3 IR expands HiRel business. IR purchases Zing Technologies, Inc. and its Wholly-owned Subsidiary, Omnirel.
Infineon produces memory chips on silicon wafers with a diameter of 300 mm, up from the previous 200 mm standard. The larger wafers hold 2.5 times more chips than their smaller predecessors. This move enables a significant leap in productivity.
Infineon breaks new ground by launching the world’s first power semiconductors based on silicon carbide (SiC). Using silicon carbide as a basis material keeps losses to a minimum and increases efficiency. SiC also significantly increases component speed.To this day, SiC is used in ThinQ! diodes, now in their fifth generation.
The world is now online. People talk to each other and buy things on the Internet. The Trusted Platform Module (TPM) SLF9630C makes sure that sensitive transactions can be carried out in safe, secure, trusted environments.
Launch of iPOWIR™ building block technology for synchronous buck converters. Expansion of power management advanced circuit design capability with new design center in Rhode Island.
In February 2002, Infineon unveils S-GOLD, a new chip designed for mobile and multimedia applications. By supporting applications such as hi-fi sound and video streaming, S-GOLD is a key milestone on the road to smartphone commercialization.
Infineon expands its development center in Bangalore. The site is one of the largest centers in the Infineon R&D network. Bangalore plays a key role in software development and hardware design. Around 250 people are employed at the site.
IR introduces DirectFET® MOSFET power packaging technology. Acquisition of TechnoFusion Power Generation Systems completed. IR acquires submicron wafer fab in Newport, Wales.
In May 2003, Infineon unveils smart sensing systems for large-area textiles. The systems measure temperature, pressure and vibration. The innovative technology can turn carpets into motion sensors or fire alarms.
Infineon’s tire pressure sensors record data such as pressure, temperature and movement. They then transfer this data wirelessly to a display in the dashboard. This increases safety and reduces fuel consumption. The module comprises sensors and a microcontroller that processes data. A transmitter then sends the data to a control unit in the engine compartment.
Infineon opens its new China headquarters in Shanghai in June 2003. This move reflects China’s growing importance for the company’s business. Key functions such as finance, HR, procurement, legal and communications are based at the new headquarters. The site is also home to marketing, sales and technical support teams. Around 150 people are employed at the Shanghai site.
IR takes initiative to produce lead-free products. IR breaks ground on new site in Xi'an China. IR modules play important role in powering Mars landers, Spirit and Opportunity.
Infineon develops a chip module for sports clothing brand O’Neill. The new technology enables Bluetooth telephony and MP3 music to be integrated into a snowboard jacket. The electronics are tailored to harsh snowboarding conditions and mark the company’s first project in the area of wearable electronics.
Industry's first dual output, two-phase DC-DC power blocks launched. IR power management technology is onboard Cassini-Huygens Space Mission, orbiting Saturn. IR acquires ATMI’s epitaxial services operation.
The new center in Bucharest develops power semiconductors that control the energy supplied to individual electronic applications such as window lifts in car doors. Infineon remains the leading manufacturer of power semiconductors to this day.
Infineon’s new passport chip saves encrypted data such as the bearer’s name, date of birth, photo and index fingerprint. The data in the chip can only be read when the passport is open. A certified, contactless read/write terminal is required for this. Just another example of how Infineon helps secure data the world over.
Infineon launches new high-frequency chips for digital terrestrial television. This move makes a significant contribution to the digitalization of terrestrial broadcasting (DVB-T). Infineon semiconductors can be found in eight out of ten of the 12 million TVs worldwide.
Infineon opens its headquarters for the Asia-Pacific region in May in Singapore. Key roles such as sales, communication and development are based at the new HQ. The new building also houses a design center and a test center for power semiconductors.
New manufacturing facility in Xi'an, China opens. IR opens customer service center in Shenzhen, China.
In February, Infineon moves into its new headquarters at the Campeon office complex in Neubiberg. The buildings are located in a 62-hectare landscape park, which includes 6.8 hectares of lakes and ponds. The new HQ can accommodate 5,000 employees. Environmentally friendly design features include a geothermal heating facility and air-con system using water from eight deep wells located south of the complex.
Infineon’s memory line of business is spun off and starts operating under the name of Qimonda on May 1. This move is part of the company’s strategy to focus on its core business addressing today’s energy efficiency, mobility and security challenges.
Infineon unveils its new mini silicon microphone for headsets and cellphones. The new microphone is just half the size of a conventional microphone and consumes one third of the energy.
In September, Infineon opens its first front-end fabrication facility in Asia at the Kulim High Tech Park (Malaysia). The company invests one billion US dollars in the production of chips for industrial and automotive applications. The facility has a maximum production capacity of 100,000 wafer starts per month.
IR introduces Class D audio chipset that cuts part count by 50% in mid-to-high-power amplifiers. International Rectifier Corporation and Vishay Intertechnology, Inc. reach an agreement for the sale of IR's Power Control Systems (PCS) business to Vishay.
The French high-speed train, the TGV, sets the world speed record in April of this year (574.8 km/h). Infineon delivers 300 IGBT modules for the TGV drive control systems.
Infineon produces the world’s smallest TVS diode. Although smaller than a sugar crystal, it can discharge loads of up to 20,000 volts. The diode is used to protect cellphones, digital cameras and MP3 players against overload as a result of electrostatic discharge, which can build up, for instance, when layers of clothing rub against each other.
Launch of SupIRBuck® versatile wide input, single output synchronous buck voltage regulators for high-performance datacenter applications. IR finalizes agreements with two semiconductor suppliers to license International Rectifier’s DirectFET® packaging technology. International Rectifier completes the sale of its Power Control Systems (PCS) business to Vishay Intertechnology, Inc. for approximately $290 million in cash.
Infineon launches NovalithIC™. The 1 cm² package combines three devices to create a powerful lineup. Two power chips and a logic circuit control and monitor electrical equipment ranging from small motors, such as the fuel pump in a car, to power-hungry devices such as drills. The IC cuts energy consumption by 80 percent by aligning output to actual demand. The move reflects Infineon’s broad-scale commitment to energy efficiency.
Infineon takes radar technology to the automotive sector, releasing a range of chips under the new RASIC™ (Radar System IC) product family. The new chips are designed for autonomous cruise control systems and radar-based safety functions such as automatic emergency breaking. The new family allows radar systems to be reduced to a quarter of their previous size. It can also help cut system costs by more than 20 percent, thus paving the way for radar systems in mid-size cars. Infineon affirms its dedication to increasing driver safety.
Oleg Khaykin named President and CEO. IR introduces revolutionary gallium nitride (GaN)-based power device technology platform. Founder and Chairman, Eric Lidow retires from his position as Chairman and member of the Board of Directors.
Infineon expands its power module fabrication site for renewable energies and drive technologies in the Hungarian city of Cegléd.
In November 2009, Infineon sells its Wireline Communication division to Lantiq. The sale is an important step that moves the company closer to its strategic goal of focusing on the core areas of energy efficiency, mobility and security.
IR’s automotive-qualified IGBTs with solderable front metal allow the use of wire bond-less packaging techniques and dual-sided cooling to provide improved thermal performance, higher efficiency and reliability of inverter modules for electric (EV) and hybrid electric vehicles (HEV).
Infineon’s new microcontrollers in the AUDO MAX family calculate the optimum air/fuel mix in combustion engines. These microcontrollers also determine the optimum injection and ignition timing for each cylinder, helping manufacturers save fuel and use energy more efficiently.
In August 2010, Infineon completes the sale of its Wireless Solution division to Intel. In total, around 3,500 employees move from Infineon to Intel Mobile Communications. This move completes the company’s strategic shift to its core areas of energy efficiency, mobility and security.
What do electronic blood pressure meters and fitness equipment have in common? They all need components that measure key indicators and support smart battery charging systems. These modules have to be as small as possible. Infineon unveils its new range of Medical Platform products, providing the perfect solutions to these medical and healthcare challenges.
IR marks 50 years of listing on the New York Stock Exchange (NYSE) by ringing The Opening Bell on Tuesday, December 7. IR introduces GaN-based iP2010 and iP2011 integrated power stage devices utilizing IR’s GaN-based technology platform, GaNpowIR®.
Electric bikes and scooters are becoming increasingly popular across the globe. Electric motors and batteries on two-wheelers have to move much less weight than cars. This translates into short recharging times and extended ranges. All of which makes these two-wheeled vehicles an extremely popular and environmentally friendly transport option. Infineon unveils end-to-end system solutions for these emerging applications.
Infineon Technologies becomes the first company worldwide to produce power semiconductors on a 300-millimeter wafer. In addition to size, the thickness of a silicon wafer is extremely important. This is because a thinner wafer results in less resistance and enables energy to be used more efficiently. Infineon’s wafers are as thin as a sheet of tracing paper.
Acquisition of CHiL Semiconductor Corporation (CHiL) expands IR's portfolio with a leading digital power management platform. IR introduces the IR3550, integrated PowIRstage® device for next-generation servers, storage and communication systems.
Lighting accounts for around 20 percent of global energy consumption. However, the lighting market is still dominated by the 100-year-old light bulb. A conventional light bulb converts around 95 percent of electrical energy into heat and just five percent into light. LEDs are a more effective alternative. Unlike light bulbs, however, LEDs cannot be connected directly to a 230-volt AC grid. This means that the mains voltage has to be efficiently converted. This can be done using a combination of chips such as power transistors, power ICs and LED drivers from Infineon. These all control a range of different factors including energy consumption. They also ensure that LEDs are 80 percent more efficient than light bulbs. An LED lasts around 30,000 operating hours, compared with just 1,000 hours in the case of a typical light bulb. Infineon is committed to making lighting more efficient.
There are many different cash-free payment functions and applications that can be integrated into the latest generation of cellphones, including vouchers, travel tickets and payment cards. All of these transactions require stringent security standards. By delivering components for these standards, Infineon plays a key role in making mobile payment more secure.
More and more wind parks are being built out at sea. These offshore sites have to be connected to power grids on land. High-voltage direct current (HVDC) transmission systems can be used to transport electrical energy efficiently over long distances. Infineon’s 4.5kV IGBT modules play a key role in these systems.
IR introduces a highly innovative 600V automotive grade IGBT platform, COOLiRIGBT™ for electric and hybrid electric vehicles. IR introduces highly integrated, ultra-compact, patent pending, µIPM™TM power modules for high efficiency appliance and light industrial applications.
Infineon’s new 3D imaging sensor chips enable operators to control computers and electronic devices with their gestures – in other words, without actually touching the device in question. The chips control an external infrared light source and, when the reflected light returns, measure the phase shift between the emitted and reflected light. This enables them to deliver 2D information on each of the sensors’ image points. The chips also provide information on distance and depth. The sensors enable devices to trace finger movements and hand gestures quickly and reliably.
BMW and Infineon worked closely together to develop the BMW i3 electric car. Seventy-five semiconductors keep the electric drive running highly efficiently. These include the AUDO Future microcontroller, the HybridPACK™ 2 IGBT power module and CoolMOS™ high-voltage MOSFETs. Infineon components are installed in the airbags, windscreen wipers and LED light modules.
IR ships product built on its revolutionary Gallium Nitride (GaN)-based power device technology platform for a home theater system manufactured by a leading consumer electronics company. IR's founder, Eric Lidow passes.
A new trend is conquering wrists: Watches are becoming fitness trainers. But Sharkey from Watchdata Technologies can do even more: Sharkey is one of the first product families on the market that also enables touchless payments or electronic ticket purchases – as securely as with a chip card. At its core, Sharkey carries a security chip from Infineon that makes mobile devices NFC-enabled and at the same time reliably protects the user’s data.
No matter how low the visibility is – with radar systems in the 77-GHz range, vehicles “recognize” other road users at a distance of up to 250 meters. The car warns the driver in case of danger or brakes automatically; up to now, this has been a privilege of premium vehicles. Infineon is developing new housing technology and manufacturing sensors with silicon-germanium technology. This will make the lifesavers affordable for other vehicle classes as well. With resounding success: In 2015, Infineon has already delivered the ten-millionth radar chip for cars and is nominated for the prestigious Future Award by the German Federal President.
After a journey of more than nine years, the spacecraft New Horizons passed the dwarf planet Pluto at a distance of only 12,500 km on July 14, 2015. On board: more than 500 HiRel components. These have to deliver a flawless performance for years without maintenance while also resisting the cosmic radiation in outer space and braving temperatures of -270° C. As large as a grand piano, the spacecraft gave astronomers their first look at Pluto from such a short distance.
In January 2015, Infineon takes over the US company International Rectifier Corporation for 3 billion US dollars. This consolidation gives Infineon additional system knowledge in the area of energy management and increases its expertise in power semiconductors. In addition, outstanding knowledge about compound semiconductors is being bundled, particularly about gallium nitride. By the end of the business year (September 30), International Rectifier has been integrated successfully; the company now has 35,400 employees.