PCIM Europe 2026 I 09-11 June in Nuremberg

Hall 7 is the place to be at PCIM. Our experts look forward to discussing the latest technological trends and innovations in our portfolio with you.

This year, we are placing a special focus on power infrastructure and related advanced technologies such as solid-state transformers and solid-state circuit breakers. We will present solutions for future architectures in AI data centers, shed light on the topic of robotics, and showcase impressive demos for innovative automotive and charging designs.

Don't forget to pick your favorite topic at the PCIM conference and on one of the many stages.

A great day at PCIM 2026

PCIM Europe
At PCIM Europe, you can see how our solutions provide answers to today’s green and digital transformation challenges. Visit us in Hall 7, Booth 470.
nuremberg, germany
June 09, 2026 - June 11, 2026
09:00 - 17:00 ( CET )

Topics and demos that await you on site

Join our speakers at the PCIM Conference.

This year, the conference will take place at NCC East.  The preliminary conference program can be found here. 

Our speakers will be giving presentations on several stages. The list of speakers will be published shortly. Stay tuned!

As renewable energy scales up, robust power infrastructure is vital to support energy-intensive demands like AI data centers or advanced factories. Innovative technical solutions are key to maintaining grid stability and scaling for the future. Our semiconductor technology powers this transformation. Solutions from Infineon enable efficient battery storage, uninterruptable power supplies, compact solid-state circuit breakers and transformers, and help data centers and industrial applications optimize power use. We're driving reliable, efficient energy delivery, ready for the age of electricity. 

You shouldn't miss this:

  • Discover our demo stack for solid-state transformers! High-voltage DC distribution to IT racks using a solid-state transformer (SST) is crucial for AI data centers in the gigawatt range. Infineon's CoolSiC™ MOSFET EasyPACK™ modules, equipped with robust .XT technology, are specifically designed to meet the demanding requirements of SSTs and power supply architectures in AI data centers. These solutions ensure long life, robustness, and exceptional thermal and electrical performance. 
  • In high power direct current (DC) power distribution systems solid-state circuit breakers (SSCB) are essential to isolate faults within microseconds. We will showcase SSCB key components for a full-scale DC distribution scheme covering three major frame sizes/ampacity classes. Infineon’s revolutionary CoolSiC™ JFET technology is designed to minimize conduction losses in normal operating mode while offering unparalleled robustness required to handle extreme overvoltage and overcurrent conditions.
  • Discover Infineon’s modular hybrid inverter design platform using the NPC2 topology as an example. Learn more about the innovative software development approach and explore model-based design (MBD), i2PECS – the Infineon tool for power electronics control software - and a hardware-in-the-loop (HIL) testing platform, which enables high reusability, increases development efficiency, and supports continuous design verification and validation with the key benefit of automated code generation. By decoupling software development from hardware, you can accelerate time-to-market, reduce costs, and gain a head start in testing and validation – all without waiting for hardware prototypes.

Increasing computing loads from AI are driving up energy demand in data centers. Our advanced portfolio – based on Si, SiC, and GaN technologies – delivers highest efficiency and power density. As conventional rack architectures can no longer meet the high power requirements, a gradual transformation toward separated IT payload racks and power sidecars is currently taking place – starting with HVDC sidecars up to DC microgrids. This scalable and energy-efficient approach forms the foundation for next-generation AI data centers. Our solutions – from the grid to the processor core – support today's and future architectures and offer high efficiency and power density for reduced total cost of ownership in data centers.

You shouldn't miss this:

  • Discover our latest single-phase and three-phase power supply unit (PSU) solution boards, which elevate conversion efficiency and power density to a new level through the use of advanced technologies and packages – including CoolMOS™, CoolSiC™, CoolGaN™ FETs, OptiMOS™ low-voltage MOSFETs, EiceDRIVER™ gate drivers, PSOC™ microcontroller series, XENSIV™ current sensors, and CoolSET™ auxiliary power controllers.
  • Get a first look at our scalable, highly efficient (>99%) battery backup unit (BBU) solutions based on Infineon's proprietary Partial Power Conversion (PPC) topology.
  • Explore our expanded portfolio of highly efficient, scalable intermediate bus converters (IBC) that support the most common conversion ratios in both high-voltage and medium-voltage domains. With regulated and unregulated topologies in discrete form and as modules, these solutions offer developers maximum flexibility. At PCIM, you will have the opportunity to see our latest reference designs.
  • Experience the next generation of voltage regulation solutions for demanding computing workloads. At PCIM, we will present our latest multi-loop, multi-protocol, multiphase controller, new point-of-load solutions, and a quad-phase TLVR power module.
  • Learn how intelligent XDP™ eFuses and hot swap controllers protect high-density data center platforms, ensure fast and reliable power path control, and minimize the risk of costly system downtime.
  • Dive into the future of power distribution – from solid-state transformers (SST) and solid-state circuit breakers (SSCB) to UPS and liquid cooling solutions.

Rapid urbanization is fueling the shift to sustainable, zero-emission mobility. Infineon drives this transformation with advanced power semiconductors and ICs for electric vehicles and charging infrastructure. As a top automotive semiconductor provider, Infineon enables green mobility through cutting-edge solutions for traction inverters, DC-DC converters, on-board chargers, and battery management, driving the growth and convenience of e-mobility worldwide.

You shouldn't miss this:

Explore our "One Inverter, One Infineon" system solution to address drivetrain efficiency, space optimization, and cost savings. All powered by Infineon's outstanding semiconductor solutions, demonstrating not only our latest CoolSiC™ ID-PAK discrete with unprecedented power density, SiC-SiC T-type-based HybridPACK™ Drive full bridge module, and HybridPACK™ SSC half bridge module, but also EiceDRIVER™304x with slew rate control, XENSIV™ TLE4973 current sensors, the latest AURIX™ TC4xx microcontroller, and the fitting XEV-PMIC.

  • HybridPACK™ SSC based system solution for inverter space optimization
  • 3 Level SiC T-Type Inverter – higher efficiency and up to 5% less battery cost 
  • CoolSiCTM ID-PAK based inverter system solution with best power density 

Are you interested in the latest on-board charger (OBC) trends? We will be showcasing three single-stage converters, each addressing a different aspect of these new power conversion topologies and demonstrating how we at Infineon enable them with our various power semiconductor technologies and packages. These include our latest CoolSiC™ and CoolGaN™ power switches in QD-PAK top-side cooling (TSC) packages, as well as our brand-new CIPOS™ PRIME and EasyPACK™ S module solutions. Of course, all of these are combined with suitable EiceDRIVER™ gate drivers for SiC and GaN, XENSIV™ current sensors, AURIX™ TC4xx microcontrollers, and corresponding PIMICs. Our goal is to empower you to achieve your design goals, your way.

  • 3.7 kW single phase, single stage matrix OBC demo based on full CoolGaN™ BDS/UDS in top-side cooling packages
  • 22 kW Single stage matrix converter OBC demo based on technology mix of CoolGaN™ BDS with CoolSiC™ in top-side cooling packages
  • 22 kW Single Stage iBiDAB OBC Demo based on full CoolSiC™ in our new CIPOS™ PRIME molded modules

Robots are transforming industries and daily life, evolving from automation to physical AI - intelligent machines that perceive, think, and act. Infineon drives this revolution with leading semiconductor solutions for every robot type: industrial, domestic, drones, and humanoids. As a global leader in microcontrollers, power systems, sensing, connectivity, and security, Infineon is powering the future of physical AI robotics.

You shouldn't miss this:

  • Humanoid arm demo with REF_HUMA_MTR_48V_25 featuring CoolGaN™, EiceDRIVER™, OPTIREG™ switcher, PSOC™ Control C3, XENSIV™, XDP™: This demo showcases a humanoid robotic arm motor drive using Infineon solutions. It features 48 V GaN‑based FOC motor control with high power density, reduced cooling needs, and low noise and vibration. Key components include a PSOC™ Control C3 MCU, CoolGaN™ Drive integrated GaN, CAN transceivers, and XENSIV™ sensors. Benefits include ultra‑compact integration (board is ≤⌀66 mm), advanced FOC with speed and position control, and robust, redundant protection.
  • Drone ESC and rotor demo with REF_ESC_48V_80A_FOC with EiceDRIVER™, OptiMOS™ 8, OPTIREG™ linear voltage regulator, PSOC™ Control C3, XENSIV™: REF_ESC_48V_80A_FOC Electronic Speed Controller (ESC) reference design demonstrates sensorless field-oriented control (FOC) for drone motors using Infineon OptiMOS™ 8 MOSFETs, a PSOC™ Control C3 MCU and a XENSIV™ TLx5572 TMR current sensor. Additionally, the reference code demonstrates flight controller communication for transmitting throttle commands from the flight controller to the ESC.
  • Thermally efficient robot motors demo with REF_MTR_48V_PSOC_C3_GaN featuring CoolGaN™, EiceDRIVER™, PSOC™ Control C3, XENSIV™: This demo highlights a thermally efficient motor‑control system using the REF_MTR_48V_PSOC_C3_GaN design. Two motorized fans create an air cushion that suspends a ball inside a clear tube, visually showing system stability and efficiency. By adjusting operating conditions, we demonstrate lower losses and improved power delivery enabled by CoolGaN™ HEMTs, a PSOC™ Control C3 MCU, EiceDRIVER™ gate drivers, and a XENSIV™ TMR sensor. The compact design supports sensored and sensorless FOC for BLDC/PMSM motors and high‑frequency operation up to 100 kHz.

Enjoy the ultimate in design flexibility with a wide range of energy-efficient Si, SiC, and GaN solutions that deliver unmatched performance and reliability to power systems. Our experts will find the best solution for your design challenge.

Stay tuned for our highlights.

The EU Cyber Resilience Act (CRA) is about to reshape how connected and embedded devices are built, certified, and maintained.

From secured by design requirements to full software transparency and mandatory vulnerability handling – we are committed to helping you not only comply with the Cyber Resilience Act (CRA) but also use it as a driver for growth and market leadership.

Stop by and have a conversation with our experts on-site – or start making yourself familiar already right now on how to stay secured today and compliant tomorrow with our EU CRA Starter Guide. 

Join our speakers at the PCIM Conference.

This year, the conference will take place at NCC East.  The preliminary conference program can be found here. 

Our speakers will be giving presentations on several stages. The list of speakers will be published shortly. Stay tuned!

As renewable energy scales up, robust power infrastructure is vital to support energy-intensive demands like AI data centers or advanced factories. Innovative technical solutions are key to maintaining grid stability and scaling for the future. Our semiconductor technology powers this transformation. Solutions from Infineon enable efficient battery storage, uninterruptable power supplies, compact solid-state circuit breakers and transformers, and help data centers and industrial applications optimize power use. We're driving reliable, efficient energy delivery, ready for the age of electricity. 

You shouldn't miss this:

  • Discover our demo stack for solid-state transformers! High-voltage DC distribution to IT racks using a solid-state transformer (SST) is crucial for AI data centers in the gigawatt range. Infineon's CoolSiC™ MOSFET EasyPACK™ modules, equipped with robust .XT technology, are specifically designed to meet the demanding requirements of SSTs and power supply architectures in AI data centers. These solutions ensure long life, robustness, and exceptional thermal and electrical performance. 
  • In high power direct current (DC) power distribution systems solid-state circuit breakers (SSCB) are essential to isolate faults within microseconds. We will showcase SSCB key components for a full-scale DC distribution scheme covering three major frame sizes/ampacity classes. Infineon’s revolutionary CoolSiC™ JFET technology is designed to minimize conduction losses in normal operating mode while offering unparalleled robustness required to handle extreme overvoltage and overcurrent conditions.
  • Discover Infineon’s modular hybrid inverter design platform using the NPC2 topology as an example. Learn more about the innovative software development approach and explore model-based design (MBD), i2PECS – the Infineon tool for power electronics control software - and a hardware-in-the-loop (HIL) testing platform, which enables high reusability, increases development efficiency, and supports continuous design verification and validation with the key benefit of automated code generation. By decoupling software development from hardware, you can accelerate time-to-market, reduce costs, and gain a head start in testing and validation – all without waiting for hardware prototypes.

Increasing computing loads from AI are driving up energy demand in data centers. Our advanced portfolio – based on Si, SiC, and GaN technologies – delivers highest efficiency and power density. As conventional rack architectures can no longer meet the high power requirements, a gradual transformation toward separated IT payload racks and power sidecars is currently taking place – starting with HVDC sidecars up to DC microgrids. This scalable and energy-efficient approach forms the foundation for next-generation AI data centers. Our solutions – from the grid to the processor core – support today's and future architectures and offer high efficiency and power density for reduced total cost of ownership in data centers.

You shouldn't miss this:

  • Discover our latest single-phase and three-phase power supply unit (PSU) solution boards, which elevate conversion efficiency and power density to a new level through the use of advanced technologies and packages – including CoolMOS™, CoolSiC™, CoolGaN™ FETs, OptiMOS™ low-voltage MOSFETs, EiceDRIVER™ gate drivers, PSOC™ microcontroller series, XENSIV™ current sensors, and CoolSET™ auxiliary power controllers.
  • Get a first look at our scalable, highly efficient (>99%) battery backup unit (BBU) solutions based on Infineon's proprietary Partial Power Conversion (PPC) topology.
  • Explore our expanded portfolio of highly efficient, scalable intermediate bus converters (IBC) that support the most common conversion ratios in both high-voltage and medium-voltage domains. With regulated and unregulated topologies in discrete form and as modules, these solutions offer developers maximum flexibility. At PCIM, you will have the opportunity to see our latest reference designs.
  • Experience the next generation of voltage regulation solutions for demanding computing workloads. At PCIM, we will present our latest multi-loop, multi-protocol, multiphase controller, new point-of-load solutions, and a quad-phase TLVR power module.
  • Learn how intelligent XDP™ eFuses and hot swap controllers protect high-density data center platforms, ensure fast and reliable power path control, and minimize the risk of costly system downtime.
  • Dive into the future of power distribution – from solid-state transformers (SST) and solid-state circuit breakers (SSCB) to UPS and liquid cooling solutions.

Rapid urbanization is fueling the shift to sustainable, zero-emission mobility. Infineon drives this transformation with advanced power semiconductors and ICs for electric vehicles and charging infrastructure. As a top automotive semiconductor provider, Infineon enables green mobility through cutting-edge solutions for traction inverters, DC-DC converters, on-board chargers, and battery management, driving the growth and convenience of e-mobility worldwide.

You shouldn't miss this:

Explore our "One Inverter, One Infineon" system solution to address drivetrain efficiency, space optimization, and cost savings. All powered by Infineon's outstanding semiconductor solutions, demonstrating not only our latest CoolSiC™ ID-PAK discrete with unprecedented power density, SiC-SiC T-type-based HybridPACK™ Drive full bridge module, and HybridPACK™ SSC half bridge module, but also EiceDRIVER™304x with slew rate control, XENSIV™ TLE4973 current sensors, the latest AURIX™ TC4xx microcontroller, and the fitting XEV-PMIC.

  • HybridPACK™ SSC based system solution for inverter space optimization
  • 3 Level SiC T-Type Inverter – higher efficiency and up to 5% less battery cost 
  • CoolSiCTM ID-PAK based inverter system solution with best power density 

Are you interested in the latest on-board charger (OBC) trends? We will be showcasing three single-stage converters, each addressing a different aspect of these new power conversion topologies and demonstrating how we at Infineon enable them with our various power semiconductor technologies and packages. These include our latest CoolSiC™ and CoolGaN™ power switches in QD-PAK top-side cooling (TSC) packages, as well as our brand-new CIPOS™ PRIME and EasyPACK™ S module solutions. Of course, all of these are combined with suitable EiceDRIVER™ gate drivers for SiC and GaN, XENSIV™ current sensors, AURIX™ TC4xx microcontrollers, and corresponding PIMICs. Our goal is to empower you to achieve your design goals, your way.

  • 3.7 kW single phase, single stage matrix OBC demo based on full CoolGaN™ BDS/UDS in top-side cooling packages
  • 22 kW Single stage matrix converter OBC demo based on technology mix of CoolGaN™ BDS with CoolSiC™ in top-side cooling packages
  • 22 kW Single Stage iBiDAB OBC Demo based on full CoolSiC™ in our new CIPOS™ PRIME molded modules

Robots are transforming industries and daily life, evolving from automation to physical AI - intelligent machines that perceive, think, and act. Infineon drives this revolution with leading semiconductor solutions for every robot type: industrial, domestic, drones, and humanoids. As a global leader in microcontrollers, power systems, sensing, connectivity, and security, Infineon is powering the future of physical AI robotics.

You shouldn't miss this:

  • Humanoid arm demo with REF_HUMA_MTR_48V_25 featuring CoolGaN™, EiceDRIVER™, OPTIREG™ switcher, PSOC™ Control C3, XENSIV™, XDP™: This demo showcases a humanoid robotic arm motor drive using Infineon solutions. It features 48 V GaN‑based FOC motor control with high power density, reduced cooling needs, and low noise and vibration. Key components include a PSOC™ Control C3 MCU, CoolGaN™ Drive integrated GaN, CAN transceivers, and XENSIV™ sensors. Benefits include ultra‑compact integration (board is ≤⌀66 mm), advanced FOC with speed and position control, and robust, redundant protection.
  • Drone ESC and rotor demo with REF_ESC_48V_80A_FOC with EiceDRIVER™, OptiMOS™ 8, OPTIREG™ linear voltage regulator, PSOC™ Control C3, XENSIV™: REF_ESC_48V_80A_FOC Electronic Speed Controller (ESC) reference design demonstrates sensorless field-oriented control (FOC) for drone motors using Infineon OptiMOS™ 8 MOSFETs, a PSOC™ Control C3 MCU and a XENSIV™ TLx5572 TMR current sensor. Additionally, the reference code demonstrates flight controller communication for transmitting throttle commands from the flight controller to the ESC.
  • Thermally efficient robot motors demo with REF_MTR_48V_PSOC_C3_GaN featuring CoolGaN™, EiceDRIVER™, PSOC™ Control C3, XENSIV™: This demo highlights a thermally efficient motor‑control system using the REF_MTR_48V_PSOC_C3_GaN design. Two motorized fans create an air cushion that suspends a ball inside a clear tube, visually showing system stability and efficiency. By adjusting operating conditions, we demonstrate lower losses and improved power delivery enabled by CoolGaN™ HEMTs, a PSOC™ Control C3 MCU, EiceDRIVER™ gate drivers, and a XENSIV™ TMR sensor. The compact design supports sensored and sensorless FOC for BLDC/PMSM motors and high‑frequency operation up to 100 kHz.

Enjoy the ultimate in design flexibility with a wide range of energy-efficient Si, SiC, and GaN solutions that deliver unmatched performance and reliability to power systems. Our experts will find the best solution for your design challenge.

Stay tuned for our highlights.

The EU Cyber Resilience Act (CRA) is about to reshape how connected and embedded devices are built, certified, and maintained.

From secured by design requirements to full software transparency and mandatory vulnerability handling – we are committed to helping you not only comply with the Cyber Resilience Act (CRA) but also use it as a driver for growth and market leadership.

Stop by and have a conversation with our experts on-site – or start making yourself familiar already right now on how to stay secured today and compliant tomorrow with our EU CRA Starter Guide.