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Innovating the future with Infineon semiconductor technology

Business & Financial Press

Oct 08, 2025

As a leader in power systems and IoT, innovation is a key differentiator for Infineon in a highly competitive semiconductor market. By leveraging the benefits of all relevant semiconductor materials silicon, silicon carbide, and gallium nitride based on a so called Integrated Device Manufacturing (IDM) strategy, Infineon is accelerating customer value and empowering innovation in the field of power electronics.

This innovative approach is particularly relevant for current megatrends such as powering AI data centers, humanoid robots and quantum computing, where Infineon's cutting-edge semiconductor solutions enable more efficient, scalable, and reliable power systems, setting the company apart from competitors and reinforce the company’s leadership in the market.

Mastering the art of semiconductor materials

Infineon's expertise and leading position in Si, SiC, and GaN is built on a foundation of first-class research and development, with a deep understanding of the unique characteristics of each semiconductor material. The company's innovative spirit has led to the development of state-of-the-art technologies, such as the world's thinnest silicon power wafer with 20 micrometers on 300 millimeter, and the broadest silicon power portfolio with CoolMOS™ technology offering the best price-performance ratio in the market.

The advantages of SiC and GaN at a glance: https://www.infineon.com/technology/wide-bandgap-semiconductors-sic-gan

Infineon is on track with its implementation of scalable GaN manufacturing on 300-millimeter wafers and will deliver first samples to customers in the fourth quarter of 2025. 300 mm GaN enables higher production capacity and faster delivery of high-quality GaN products allowing customers to create solutions with higher power density and switching frequency in a smaller form factor. Highly efficient and easy to design in power solutions like CoolGaN™ bi-directional switching (BDS) will further drive adoption of GaN in industries such as robotics and automotive.

As global decarbonization efforts drive demand for robust power semiconductors in renewable energies such as wind or solar, and in the automotive industry with the rise of electric vehicles, Infineon pushes the boundaries of innovation in silicon carbide with the world’s most cost-competitive 200 mm SiC fab. Power solutions based on Infineon’s CoolSiC™ technology offer high reliability and robustness in harsh conditions with voltages from 400V to 3.3kV. Infineon’s high-scale 200 mm SiC fab complements the company’s leading position in Si and GaN solutions manufactured on 300-millimeter wafers in Villach and Dresden.

Powered by its IDM strategy, Infineon owns the entire chip process in-house, from design to manufacturing and packaging. This way, the company is able to provide tailored solutions that meet customers’ specific requirements, across all voltage classes and applications. With this unique capability, Infineon is well-positioned to address the emerging challenges in the field of artificial intelligence, where innovative power management solutions are essential to support the growing demand for energy-efficient and high-performance computing.

AI revolution is accelerating innovation

The growing demand for energy in AI data centers is unprecedented, with forecasts suggesting that AI-related energy consumption will increase exponentially in the coming years. For instance, it's estimated that by 2030, AI data centers will consume around 7% of global electricity demand, up from around 2% in 2022. Training a single AI model can consume up to 1,300 MWh of energy, equivalent to the annual energy consumption of 130 US homes. The increasing power requirements of AI processors, such as GPUs and TPUs, are driving this growth, with some models requiring up to 2,000 watts of power per processor. To address this challenge, innovation in power management is inevitable.

Establishing a partner ecosystem is essential to develop the necessary solutions to power AI data centers. By collaborating with industry leaders, Infineon is able to leverage its expertise in power systems and semiconductor technologies to develop highly efficient and reliable power supply systems. The company's collaboration with Nvidia on an 800 Volt direct current (VDC) architecture for future AI data centers is a prime example of this. This innovative architecture will enable server racks to operate at power levels of 1 MW and beyond, providing a highly efficient and reliable power supply system that allows data center operators to maximize their computing power while minimizing their energy consumption and environmental impact.

This collaborative approach enables Infineon to stay at the forefront of innovation in powering AI, and to provide highly efficient power conversion solutions from grid to core for more sustainable AI data centers.

Building on this expertise in AI and power management, Infineon is also leveraging its semiconductor technologies to bring Physical AI systems to life in other fields, such as robotics, where the company's comprehensive portfolio of solutions is enabling the development of innovative and interactive robots.

Si, SiC and GaN bringing humanoid robots to life

With a proven track record of expertise in automotive, consumer, and industrial markets, combined with the market leadership in microcontrollers and power systems, Infineon has established itself as the trusted semiconductor partner for the robotics market. A comprehensive hybrid portfolio of Si, SiC, and GaN based solutions, including sensors, connectivity, safety, and security, enables Infineon to provide a robust foundation for the development of humanoid robots forecasted to reach 5 trillion dollars by 2050.

Power systems, microcontrollers, sensors, connectivity, and security solutions work together to give humanoid robots the ability to safely perceive, think, and act in real-world environments. Whether it's allowing a robot to navigate complex spaces or empowering an industrial robot to perform precise tasks – enabled by semiconductors, the possibilities for robotics are endless, with Infineon being at the forefront of this rapidly evolving field. As

Infineon continues to push the boundaries of innovation in robotics and artificial intelligence, the company is also exploring new frontiers in computing, where the potential of quantum computing is expected to revolutionize the way we process information and solve complex problems.

More about humanoid robots: https://www.infineon.com/applications/robotics

Quantum computing take us to new dimensions

Quantum computing is the next transformational technology with huge potential to deliver unparalleled advances in performance. As a leading semiconductor manufacturer, Infineon has expertise in the industrialization of quantum technologies. Infineon is using this know-how to lead quantum computing from fundamental research into versatile application, to make it an economic success and thus to make our society digitally more sovereign.

Infineon is actively engaged as a provider of components, tech-platforms and solutions that build the foundation to develop competitive and scalable quantum computers. Since 2017, our Ion Trap Systems group in Villach applies its engineering competences on predictable, reliable trapped ion platform to leverage scalable quantum processing units (QPU). We collaborate with excellent partners in science and industry including innovative startups to accelerate the path towards utility-scale quantum computing.

However, quantum computing poses significant risks to cybersecurity. Infineon has the unique position to navigate both: driving the performance of quantum computing while protecting against the associated threats. As an expert authority and leading provider of crypto controllers, Infineon is actively driving the progress of post-quantum cryptography with the world’s first common criteria on a security controller.

In summary, Infineon's commitment to innovation, customer value, and its IDM strategy reinforce the company’s position as a leader in the semiconductor industry. The expertise in Si, SiC, and GaN, as well as collaborations with industry leaders as partners, is accelerating Infineon’s innovation spirit to further drive decarbonization and digitalization in the world’s most significant markets of the future.

Click here to watch the video “When will quantum computing become a reality?”: https://www.youtube.com/watch?v=gitittggnCk

More about quantum expertise at Infineon: www.infineon.com/quantumcomputing

PRESS PHOTOS

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About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 58,060 employees worldwide and generated revenue of about €15 billion in the 2024 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

Press Photos

Infineon Villach

Site Villach, Infineon Austria

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Alina Absmaier

Alina Absmaier, Head of Produktion Infineon Austria

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Richard Kuncic

Richard Kuncic, Senior Vice President & General Manager Business Line Power Switches Infineon Austria

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Johannes Schoiswohl

Johannes Schoiswohl, Senior Vice President & General Manager Business Line Head GaN Systems

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Michael Sorger

Michael Sorger, Head of WBG Technology Transfer and Conversion Management

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Martin Poelzl

Martin Poelzl, Vice President R&D PSS Business Line Power Switches

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Gallium nitride-, silicon carbide- und silicon-wafer

Left: 300 millimeter silicon (Si) ultra-thin-wafer (20 micrometer), middle: 200 millimeter silicon carbide (SiC) wafer, right: 300 millimeter gallium nitride (GaN) wafer

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