S-COM10.6

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

S-COM10.6
S-COM10.6

Product details

  • Applications
    payment, authentication, government identification
  • Contact Surface
    NiAu
  • Delivery Forms
    Tape on Reel
  • Derivatives
    Au surface, Pd surface
  • Dimensions
    13 x 11.8mm
  • ISO – Reference
    ISO 14443, ISO 10373-1/-3, ISO 7810, ISO 7816-1
  • Leading Technologies
    Coil on module
  • Pitch
    14.25 mm
  • Product Description
    with inductive coupling, for high demanding applications,, dual interface module
  • Product Name
    S-COM10.6
  • Thickness
    max. 420µm
OPN
Product Status
Infineon Package
Package Name
Packing Size
Packing Type
Moisture Level
Moisture Packing
Lead-free
Halogen Free
RoHS Compliant
Infineon stock last updated:
CoM10.6 Dual Interface Module Build with innovative  Coil on Module technology from Infineon to connect the module and the card antenna:
  • eliminates the galvanic connection process
  • simplifies the production
  • improves the production yield
  • improves the mechanical robustness
  • dedicated for 10 years life time applications
Moreover the reduced module thickness provides an unknown flexibility in the card construction. Coil on Module demonstrates Infineon's technology leadership based on extensive semiconductor and module expertise as well as profound understanding of card manufacturer’s systems and requirements.

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }