Active and preferred
RoHS Compliant
Lead-free

OC1230

World’s tiniest GSMA-compliant and world’s first 28 nm eSIM solution optimized for mobile consumer devices
Data Sheet
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OC1230
OC1230
Data Sheet

Product details

  • Ambient Temperature
    -40 °C to 85 °C
  • Applications
    Consumer devices (smartphones, wearables, tablets, notebooks)
  • Asymmetric Cryptography
    RSA up to 2048 bit, ECC up to 521 bit, NIST P-256, Brainpool256r1, FRP256V1
  • Certifications
    GSMA, 3GPP
  • CPU
    32-bit
  • Delivery Forms
    SG-XFWLB-16-1, PG-X2QFN-20-1
  • Interfaces
    ISO 7816, SPI
  • NVM
    1.1 MByte
  • Product Description
    OPTIGA™ Connect Consumer OC1230 is a 5G-ready eSIM turnkey solution optimized for mobile consumer devices. RSP and MEP compliant with GSMA SGP.22 v3 greatly enhance the end user experience.
  • Symmetric Cryptography
    AES up to 256 bit, DES
  • Use Cases
    eSIM (embedded SIM)
Recommended
OPN
OC12301010X2QFNXTMA2 OC12301010WLB16XTMA2
Product Status active and preferred active and preferred
Infineon Package
PG-X2QFN-20
SG-XFWLB-16
Package Name N/A N/A
Packing Size 5000 1
Packing Type TAPE & REEL TAPE & REEL
Moisture Level N/A N/A
Moisture Packing NON DRY NON DRY
Lead-free Yes Yes
Halogen Free Yes Yes
RoHS Compliant Yes Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-X2QFN-20
Package Name -
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level -
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status
Active
Infineon Package
SG-XFWLB-16
Package Name -
Packing Size 1
Packing Type TAPE & REEL
Moisture Level -
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
OPTIGA™ Connect Consumer OC1230 comes with a rich feature set optimized for mobile consumer devices, making it the perfect fit for even the tiniest mobile consumer devices like smart watches and other wearables. The security architecture is based on the Arm® v8 and Infineon’s Integrity Guard 32 technology for increased performance and less power consumption. RSP and MEP compliant with GSMA SGP.22 v3 greatly enhance the end user experience.  *NPI planned in the first two quarters of 2026.

Features

  • Global eSIM service interoperability
  • RSP and MEP GSMA SGP.22 v3 compliant
  • SOTA/OS patching
  • Up to 1.1 MB free user memory
  • GSMA eUICC Security Assurance (eSA) scheme certified
  • Voltage classes: C (1.8 V), D (1.2 V)
  • Interfaces: ISO7816, SPI
  • WLCSP (1.8 x 1.6 x 0.4 mm) package
  • X2QFN20 (3.0 x 3.0 x 0.3 mm) package

Benefits

  • World’s tiniest GSMA-compliant eSIM
  • World´s first 28 nm eSIM
  • Easy integration
  • Full interoperability
  • 25% better performance / power ratio
  • Extended battery lifetime
  • Future-proof security platform
  • Rich new features: e.g. OS patching, MEP
  • Improved end user experience
  • Post-quantum cryptography (PQC) ready

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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