Active and preferred
RoHS Compliant

CYW55572

Wi-Fi 6 tri-band 2x2 Wi-Fi and Bluetooth® 6.0 SoC
Data Sheet
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CYW55572
CYW55572
Data Sheet

Product details

  • Antenna Configuration
    2x2
  • Bluetooth Interface
    UART/PCM/I2S
  • Bluetooth Specification
    Bluetooth 6.0
  • Core
    Cortex-M33
  • CPU
    N/A
  • Dimensions
    5.32 x 5.67 mm, 12 x 12 mm, 5.3 x 5.7 mm
  • Family
    AIROC™ Wi-Fi + Bluetooth® Combos
  • GPIOs
    15
  • Launch Date
    2023
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Memory
    N/A
  • Operating system support
    Linux, Android
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    3 V to 4.8 V
  • Package
    WLCSP-486, WLBGA-225, FCFBGA-289
  • Partner Module
    Y
  • Pitch
    0.2 mm, 0.35 mm, 0.65 mm
  • Currently planned availability until at least
    01-01-2038
  • Product Description
    Wi-Fi 6 Combo
  • ROM
    2000 KB
  • SRAM
    512 kByte
  • Wi-Fi Band
    2.4GHz, 5GHz
  • WI-FI Interface
    SDIO/PCIe
  • Wi-Fi Specification
    Wi-Fi 6 (802.11ax)
Recommended
OPN
CYW55572MIFFBGT CYW55572MIWBGT CYW55572MIUBGT
Product Status active and preferred active and preferred active and preferred
Infineon Package
PG-TF2BGA-289
SG-XFWLB-486 SG-UFWLB-225
Package Name FCFBGA-289 (002-29083) WLCSP-486 (002-29726) WLBGA-225 (002-36128)
Packing Size 1500 5000 5000
Packing Type TAPE & REEL TAPE & REEL TAPE & REEL
Moisture Level 3 1 1
Moisture Packing DRY NON DRY NON DRY
Lead-free No No Yes
Halogen Free No No Yes
RoHS Compliant Yes Yes Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-TF2BGA-289
Package Name FCFBGA-289 (002-29083)
Packing Size 1500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status
Active
Infineon Package SG-XFWLB-486
Package Name WLCSP-486 (002-29726)
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status
Active
Infineon Package SG-UFWLB-225
Package Name WLBGA-225 (002-36128)
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
The AIROC™ CYW55572 is part of Infineon's Wi-Fi 6 and Bluetooth® 5.3 SoC family. The highly integrated solution supports dual-band Wi-Fi 6 (2.4G, 5G) 2x2 MIMO. It offers an exceptional video/audio streaming and seamless gaming experience in congested network environments and significantly boosts range and coverage, while also decreasing total Bill of Materials cost and board space.

Features

  • Wi-Fi 6, dual-band, 2x2 MIMO
  • 20/40/80 MHz, up to 1.2 Gbps PHY rate
  • OFDMA, MU-MIMO, TWT,DCM
  • Enhanced range, pwr & network efficiency
  • Multi-layer security protection
  • Smart coexistence
  • Temperature: -40°C to 85°C
  • Bluetooth® 5.3, Dual-mode operation
  • LE audio w/Auracast, LE- 2M, LR, Adv Ext
  • Bluetooth transmit at 20dbm/13dbm/0 dbm

Benefits

  • Performance beyond Wi-Fi 6/6e
  • Maximizes network efficiency
  • Extended edge AI+IoT device capabilities
  • High quality Bluetooth® LE audio
  • Multi-layer security protection
  • Accelerates time to market
  • Reduces development costs

Diagrams

CYW55572_3-Block-Diagram
CYW55572_3-Block-Diagram
CYW55572_3-Block-Diagram CYW55572_3-Block-Diagram CYW55572_3-Block-Diagram
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Documents

Documents

Design resources

Partner solutions

Developer community

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