Active and preferred
RoHS Compliant

CYBLE-333073-02

Data Sheet
package

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CYBLE-333073-02
CYBLE-333073-02
Data Sheet

Product details

  • ADC (#, Max. Resolution @ Sample Rate)
    SD(1,12 bit ENoB (audio), 10-bit ENoB (DC), 12MHz Clock)
  • Base Silicon
    CYW20835
  • Bluetooth Classic
    No
  • Bluetooth EDR 2MBPS RX SENSITIVITY
    N/A
  • Bluetooth EDR 2Mbps TX POWER
    N/A
  • Bluetooth LE Data rate
    2 MByte/s
  • Bluetooth LE RX SENSITIVITY
    - 94.5 dBm
  • Bluetooth LE TX POWER
    12 dBm
  • Bluetooth LE
    Yes
  • CapSense
    No
  • CPU Core
    96MHz
  • Extended Range
    No
  • Family
    AIROC™ Bluetooth Modules
  • Flash
    512 kByte
  • GPIOs
    24
  • I2C
    1
  • Launch Date
    31-12-2019
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Main CPU Core
    Arm® Cortex®- M4
  • Operating Temperature
    -30 °C to 85 °C
  • Operational Amplifier
    No
  • Pads
    45
  • PDM
    1
  • Planned to be available until at least
    31-12-2034
  • PWM
    6
  • ROM
    2MB
  • Secondary CPU Core
    None
  • Serial Communication Blocks
    0
  • Size (X mm x Y mm x Z mm)
    13.31 x 21.89 x 1.95 mm
  • SPI
    1
  • SRAM
    384 kByte
  • Type of Antenna
    External - RF pad
  • UART
    2
  • V
    2.5 V to 3.6 V
Recommended
OPN
CYBLE-333073-02
Product Status active and preferred
Infineon Package
LG-MLGA-42
Package Name MODULE-42 (002-28053)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
LG-MLGA-42
Package Name MODULE-42 (002-28053)
Packing Size 500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Infineon’s AIROC™ CYBLE-333073-02 is a fully certified Bluetooth® LE module based on Infineon’s CYW20835. This embedded module includes a royalty-free Bluetooth® stack compatible with Bluetooth® 5.0 and is available in 13.31 x 21.89 x 1.95 mm SMT form-factor. This module complies with Bluetooth® Core 5.2 and has gone through Qualification with Required Testing path with Declaration ID D056777 and QDID 176091.

Features

  • FCC, ISED, MIC, and CE certified
  • Onboard crystal oscillator
  • Passive components
  • Flash memory
  • RF solder pad for external antenna

Benefits

  • Support fast time-to-market
  • Support a wide spectrum of applications

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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