Active and preferred
RoHS Compliant

CY7C2663KV18-550BZXI

Data Sheet
package

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CY7C2663KV18-550BZXI
CY7C2663KV18-550BZXI
Data Sheet

Product details

  • Architecture
    QDR-II+
  • Bank Switching
    N
  • Burst Length (Words)
    4
  • Data Width
    x 18
  • Density
    144 MBit
  • ECC
    N
  • Family
    QDR-II+
  • Frequency
    550 MHz
  • Interfaces
    Parallel
  • Lead Ball Finish
    Sn/Ag/Cu
  • On-Die Termination
    N
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    1.7 V to 1.9 V
  • Organization (X x Y)
    8Mb x 18
  • Peak Reflow Temp
    260 °C
  • Qualification
    Industrial
  • Read Latency (Cycles)
    2.5
Recommended
OPN
CY7C2663KV18-550BZXI
Product Status active and preferred
Infineon Package
PG-BGA-165
Package Name FBGA-165 (51-85195)
Packing Size 105
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-BGA-165
Package Name FBGA-165 (51-85195)
Packing Size 105
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

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