FBGA-165 (51-85195)

PG-BGA-165-805

Package details

  • Package Material
    PG
  • Package Family
    PG-BGA
  • Terminals
    165
  • Variant
    805
  • Exposed Paddle
    No
  • Body Length (mm)
    16.993
  • Body Width (mm)
    14.986
  • Min. Terminal Pitch (mm)
    1.0
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
     
    1000
    1
  • TRAY
    Pieces/Reel
    Reels/Box
     
    1050
    10
Infineon ball grid array (BGA) packages are offered as various families. They are available as low (L), thin (T), and very thin (V) profile versions. Finepitch (F) products as well as flip-chip (FC) versions are specifically designated. Legacy designations my include ultra fine ball grid array (UFBGA) or very very thin profile fine pitch ball grid array (WFBGA). The BGA concept typically utilizes an overmolded laminate substrate with fanout to connect on the bottom of the package rather than around its perimeter. The pre-soldered ball-shaped terminations allow for high-throughput board mounting using surface mount technology (SMT). The footprints are usually symmetric and the solder ball terminations provide a stable stand-off after board mounting. Typical products are a high number of signal lines e.g. for microcontrollers and memory.

Image Gallery

PG-BGA-165-805_Footprint Drawing
PG-BGA-165-805_Footprint Drawing
PG-BGA-165-805_Footprint Drawing PG-BGA-165-805_Footprint Drawing PG-BGA-165-805_Footprint Drawing
PG-BGA-165-805_Bakeable Trays PG-BGA-165-805_Bakeable Trays PG-BGA-165-805_Bakeable Trays
PG-BGA-165-805_Tape and Reel PG-BGA-165-805_Tape and Reel PG-BGA-165-805_Tape and Reel
PG-BGA-165-805_Package Outline PG-BGA-165-805_Package Outline PG-BGA-165-805_Package Outline
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Documents and drawings

Documents and drawings