PG-MDIP-11-1

Package details

  • Package Material
    PG
  • Package Family
    PG-MDIP
  • Terminals
    11
  • Variant
    1
  • Exposed Paddle
    No
  • Body Length (mm)
    42.0
  • Body Width (mm)
    40.0
  • Min. Terminal Pitch ()
    0.0
Infineon offers different module dual inline packages (MDIP). Molded power module with double sided cooling feature a considerably smaller outline in comparison with frame based power modules. The leaded termination design allows for various mounting techniques such as welding. Typical products are IGBT, MOSFET modules and intelligent power modules (IPM).

Image Gallery

PG-MDIP-11-1_Package Outline
PG-MDIP-11-1_Package Outline
PG-MDIP-11-1_Package Outline PG-MDIP-11-1_Package Outline PG-MDIP-11-1_Package Outline

Documents and drawings