Automotive qualified IGBTs
Automotive qualified IGBT solutions supporting designer's efforts in hybrid and electric mobility
Automotive qualified IGBTs subcategoriesCollapse all subcategories Expand all subcategories
Infineon’s broad range of Automotive IGBTs are designed for high voltage switching applications. Due to their high efficiency and reliability, insulated gate bipolar transistors (IGBT) are the perfect match for (plug-in) hybrid vehicles and electric cars.
Our highly dependable semiconductor solutions support a wide range of motors, generators, and power classes, enabling compact and cost-efficient system designs that provide high energy efficiency thanks to the reduction of power losses. IGBTs are essential for electronic control systems, including motor control systems, inverters, and on-board chargers.
High-efficiency, low-loss automotive IGBT discretes bundle our outstanding TrenchStop™ and FieldStop technologies to reduce saturation voltages well below the levels offered by competing standard NPT IGBTs – without increasing the switching losses. These IGBT discretes offer maximum flexibility and scalability when it comes to the application design for all power classes.
Infineon’s automotive IGBT modules portfolio includes the HybridPACK™ and EasyPACK™ product families which are equipped with our leading IGBT technologies, such as EDT2, that provide excellent efficiency and high reliability. Distinct from automotive IGBT discretes, automotive IGBT modules cover power classes from 30-180kW, with one single B6-module or 3 half-bridge modules. They provide ease-of-use in designing and manufacturing the inverter and are optimized for direct water cooling and include isolation.
Automotive IGBT Product Solutions
Infineon’s range of automotive IGBT modules includes HybridPACK™ Drive, HybridPACK™ DSC, HybridPACK™ 1 &DC6(i), and EasyPACK™. Available in half-bridge, fourpack, and sixpack power semiconductor configurations, Infineon’s automotive IGBT modules set quality and reliability standards for power modules in hybrid and electric vehicles.
Our HybridPACK™ family enables a smooth transition across all power classes from HEV to EV (from 10 kW to 180 kW). These integrated power modules contain all power semiconductors required to drive electric motors of up to 180 kW, within the 750V and 1200V class, with the added bonus of compact inverter designs and optimum support for water cooling. For power ranges above 180 kW, the new HybridPACK™ Drive CoolSiCTM version is available, based on Infineon’s silicon carbide trench MOSFET structure.
Our EasyPACK™ automotive power modules are very compact and flexible half-bridge solutions for traction inverter, auxiliary, OBC, and DC-DC applications of hybrid and electric vehicles. This package enables high integration density as well as a fast and easy assembly process. The EasyPACK™ 1B and EasyPACK™ 2B footprints are the perfect flexible power modules for low-power solutions. Soon available in the market will be the automotive EasyPACK™ 2B, containing Infineon´s latest EDT2 chip technology, to maximize efficiency and cost-effectiveness for low power inverters.
Furthermore, designed for hybrid and electric vehicles, Infineon’s extensive portfolio of automotive IGBT discretes includes IGBTs with, and without, anti-parallel diodes. Developed with our world-class TrenchStop™ and EDT2 technologies, our discrete range of products offers the highest efficiency due to extremely low switching and conduction losses. Additionally, using IGBT discretes allows for very compact, yet easily scalable designs.
IGBT stands for Insulated Gate Bipolar Transistor. IGBTs are useful for switching power supplies and help to convert electrical power in an efficient and reliable way in electronic systems.
IGBTs are useful in medium to high power applications involving higher voltages and higher current as opposed to MOSFETs which are more suitable for relatively lower power applications.
Infineon Automotive IGBTs meet the stringent automotive requirements are the ideal switch for high-voltage applications in both conventional cars and hybrid electric vehicles (HEVs). Thanks to their high switching frequency and short-circuit rating, they enable high efficiency and robust automotive designs.
The Infineon HybridPACK™ family features new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications. Variations in the requirements for mild and full hybrid applications have been taken into account for each design.
Various product versions in five different packages enable maximum scalability across voltage and power classes ranging from 200 A to 900 A and 400 V to 1200 V (nominal chip values). The HybridPACK™ modules feature half-bridge and six-pack IGBTs and are specially designed and qualified for automotive applications.
Our EasyPACK IGBT modules enable a high integration density and a fast and easy assembly process. With its two footprints Easy 1B and Easy 2B it provides a platform for different power classes. As the EasyPACK™ is a very flexible package, customization to fit the customer’s needs is possible by adding further chip technologies in different topologies.
For the automotive EasyPACK™ we took our long proven industrial Easy modules and integrated different chip contents and topologies for automotive auxiliary, OBC and DC-DC applications. To ensure highest quality standards and safety, the package technology has then been improved and qualified to meet automotive requirements.
The automotive Easy1B and Easy2B packages are easy-to-assemble modules for high voltage auxiliaries and DC-DC converters in hybrid and electric vehicles.
They provide a platform for flexible topologies for applications with a power range of up to 6kW. The automotive Easy Module Series is based on the well-established industrial Easy Module version. The availability of a high voltage battery system in both HEVs and EVs offers the possibility to increase the efficiency and to reduce the cost of some applications that are today supplied by the low voltage board-net (14V) in IC engine vehicles.
RC-Drives IGBT technology has been developed by Infineon as a cost optimized solution by offering space saving advantages due to monolithically integrated diodes. It delivers low conduction losses and high reliability. Furthermore the technology provides outstanding performance for smooth switching behavior and low EMI levels even at the maximum junction temperature of 175°C.
Striving for the highest standards in performance and quality, Infineon offers a comprehensive discrete IGBT portfolio that is second to none. New products are application-specific developed to achieve the highest value for applications such as Traction inverter or Onboard charger. They cover voltage classes from 600V up to 1200V, a wide range of current ratings as well as different packages.
The automotive IGBT discretes are ideal for high voltage xEV applications where efficiency, scalability space and system cost savings are key priorities.
Discrete-based inverters are known for being flexible, scalable, and cost-efficient systems. Due to their adaptable form factor, discrete devices provide a significant advantage for system integration. Parallelizing devices to reach different power classes enables a scalable inverter platform.