Automotive qualified IGBTs
Automotive qualifed IGBT solutions to support the designer's efforts in hybrid and electric mobility
Infineon’s range of Automotive IGBTs are designed for high voltage switching applications. Due to their high-efficiency and reliability they are the perfect match for hybrid vehicles and electric cars.
Our highly reliable semiconductor solutions support a wide range of motors, generators and power classes, enabling compact and cost-efficient system designs that offer high energy efficiency thanks to the reduction of power losses.
Our HybridPACK™ family enables a smooth transition across all power classes from HEV to EV (from 10 kW to 175 kW). These integrated power modules contain all power semiconductors required to drive electric motors of up to 175 kW, with the added bonus of compact inverter designs and optimum support for water cooling.
Our EasyPACK™ automotive power modules with a high-speed IGBT3 and rapid diode enable a compact design and the highest energy efficiency ratings for converters from about 2–10 kW. The EasyPACK™ 1B/2B is the perfect flexible power module solutions for low-power charging solutions.
High-efficiency, low-loss automotive IGBT discretes bundle our outstanding trench- and fieldstop technologies to reduce saturation voltages well below the levels offered by competing standard NPT IGBTs – without increasing the switching losses. These IGBT discretes offer maximum flexibility and scalability when it comes to the application design, for all power classes.
IGBT stands for Insulated Gate Bipolar Transistor. IGBTs are useful for switching power supplies and help to convert electrical power in an efficient and reliable way in electronic systems.
IGBTs are useful in medium to high power applications involving higher voltages and higher current as opposed to MOSFETs which are more suitable for relatively lower power applications.
Infineon Automotive IGBTs meet the stringent automotive requirements are the ideal switch for high-voltage applications in both conventional cars and hybrid electric vehicles (HEVs). Thanks to their high switching frequency and short-circuit rating, they enable high efficiency and robust automotive designs.
The Infineon HybridPACK™ family features new power semiconductor modules which have been specifically designed for hybrid electric vehicle applications. Variations in the requirements for mild and full hybrid applications have been taken into account for each design.
Various product versions in five different packages enable maximum scalability across voltage and power classes ranging from 200 A to 900 A and 400 V to 1200 V (nominal chip values). The HybridPACK™ modules feature half-bridge and six-pack IGBTs and are specially designed and qualified for automotive applications.
Our EasyPACK IGBT modules enable a high integration density and a fast and easy assembly process. With its two footprints Easy 1B and Easy 2B it provides a platform for different power classes. As the EasyPACK™ is a very flexible package, customization to fit the customer’s needs is possible by adding further chip technologies in different topologies.
For the automotive EasyPACK™ we took our long proven industrial Easy modules and integrated different chip contents and topologies for automotive auxiliary, OBC and DC-DC applications. To ensure highest quality standards and safety, the package technology has then been improved and qualified to meet automotive requirements.
The automotive Easy1B and Easy2B packages are easy-to-assemble modules for high voltage auxiliaries and DC-DC converters in hybrid and electric vehicles.
They provide a platform for flexible topologies for applications with a power range of up to 6kW. The automotive Easy Module Series is based on the well-established industrial Easy Module version. The availability of a high voltage battery system in both HEVs and EVs offers the possibility to increase the efficiency and to reduce the cost of some applications that are today supplied by the low voltage board-net (14V) in IC engine vehicles.
RC-Drives IGBT technology has been developed by Infineon as a cost optimized solution by offering space saving advantages due to monolithically integrated diodes. It delivers low conduction losses and high reliability. Furthermore the technology provides outstanding performance for smooth switching behavior and low EMI levels even at the maximum junction temperature of 175°C.