HybridPACK™ DSC

HybridPACK™ DSC is the perfect high power density solution for your compact, flexible, and integrated inverter design

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Overview

The HybridPACK™ DSC from Infineon offers best-in-class thermal performance and power density, thanks to its innovative double-sided cooling (DSC) approach. This product family is specifically designed for electric vehicle traction inverters, providing a scalable power range within the 750 V and 1200 V classes.

Key Features

  • Double-sided cooling
  • Compact design
  • Low switching losses
  • Available with Si IGBT and CoolSiC™
  • Blocking voltage 750 V and 1200 V

Products

About

Infineon's HybridPACK™ DSC

Our emphasis on innovation is not only recognizable in the variety of frame-based power modules but also in the HybridPACK™ DSC. Thanks to its double-sided cooling technology and half-bridge configuration, this power module is the ideal solution for compact, flexible, and integrated Si-based main inverter designs up to 75 kW. Two copper plates on both sides of the module are used for double-sided cooling (DSC) and herewith enable high power density. On-chip temperature and current sensors (overcurrent protection) offer a good compromise between security and performance. HybridPACK™ DSC modules offer scalability to support customers’ platform approach.

Next generation DSC with CoolSiC™ G2 technology

Infineon recognizes the complementary strengths of Si IGBT and SiC MOSFET technologies. In line with this belief, Infineon has launched the next generation of HybridPACK™ DSC featuring the advanced CoolSiC™ chipset. This new module delivers up to double the performance of previous Si-based DSC-S solutions, offering significant improvements under comparable conditions.

HybridPACK™ DSC CoolSiC™ power modules offer a compact and flexible traction inverter solution, leveraging Infineon's advanced CoolSiC™ G2 technology 

With a track record of more than 10 million units sold since 2017, the HybridPACK™ DSC is one of Infineon’s market-leading power module family for electric vehicles.

Benefits of HybridPACK™ DSC
  • High-power density package enabling very compact inverters
  • CoolSiC™ G2, IGBT3 and EDT2 chip offers benchmark efficiency for electric vehicle inverters
  • Advanced on-chip-temperature and current sensor
  • Offers advanced reliability and robustness
  • Proven package with over 10 Mio DSC modules already in use in various hybrid and plug-in hybrid vehicles as of today
HybridKIT™ for HybridPACK™ DSC S2 - automotive power module

Evaluation kit for HybridPACKTM DSC S2 automotive power module (FF450R08A03P2)

Automotive power module (FF450R08A03P2)
EV INV HP DSC SI FF450
What are the key highlights of Infineon's HybridPACK™ DSC?
  • Enhanced thermal performance by DSC
  • Flexible and compact package
  • Compact high voltage package by transfer mold
  • Advanced protection by on-chip current and temperature sensor
  • High temperature operational

Infineon's HybridPACK™ DSC

Our emphasis on innovation is not only recognizable in the variety of frame-based power modules but also in the HybridPACK™ DSC. Thanks to its double-sided cooling technology and half-bridge configuration, this power module is the ideal solution for compact, flexible, and integrated Si-based main inverter designs up to 75 kW. Two copper plates on both sides of the module are used for double-sided cooling (DSC) and herewith enable high power density. On-chip temperature and current sensors (overcurrent protection) offer a good compromise between security and performance. HybridPACK™ DSC modules offer scalability to support customers’ platform approach.

Next generation DSC with CoolSiC™ G2 technology

Infineon recognizes the complementary strengths of Si IGBT and SiC MOSFET technologies. In line with this belief, Infineon has launched the next generation of HybridPACK™ DSC featuring the advanced CoolSiC™ chipset. This new module delivers up to double the performance of previous Si-based DSC-S solutions, offering significant improvements under comparable conditions.

HybridPACK™ DSC CoolSiC™ power modules offer a compact and flexible traction inverter solution, leveraging Infineon's advanced CoolSiC™ G2 technology 

With a track record of more than 10 million units sold since 2017, the HybridPACK™ DSC is one of Infineon’s market-leading power module family for electric vehicles.

Benefits of HybridPACK™ DSC
  • High-power density package enabling very compact inverters
  • CoolSiC™ G2, IGBT3 and EDT2 chip offers benchmark efficiency for electric vehicle inverters
  • Advanced on-chip-temperature and current sensor
  • Offers advanced reliability and robustness
  • Proven package with over 10 Mio DSC modules already in use in various hybrid and plug-in hybrid vehicles as of today

What are the key highlights of Infineon's HybridPACK™ DSC?
  • Enhanced thermal performance by DSC
  • Flexible and compact package
  • Compact high voltage package by transfer mold
  • Advanced protection by on-chip current and temperature sensor
  • High temperature operational

Documents

Documents

Design resources

Developer community

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