Active and preferred
RoHS Compliant

IQDH45N04LM6

OptiMOS™ power MOSFETs 40 V logic level in PQFN 5x6 Source-Down package with very low RDS(on).
ea.
in stock

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IQDH45N04LM6
IQDH45N04LM6
ea.

Product details

  • Budgetary Price €/1k
    1.45
  • ID (@25°C) max
    637 A
  • IDpuls max
    2548 A
  • Mounting
    SMD
  • Operating Temperature
    -55 °C to 175 °C
  • Package
    PQFN 5x6 Source-Down
  • Polarity
    N
  • QG (typ @4.5V)
    62 nC
  • QG (typ @10V)
    129 nC
  • RDS (on) (@10V) max
    0.45 mΩ
  • RDS (on) (@4.5V) max
    0.58 mΩ
  • Special Features
    Logic Level
  • VDS max
    40 V
  • VGS(th)
    1.6 V
OPN
IQDH45N04LM6ATMA1
Product Status active and preferred
Infineon Package
Package Name PQFN 5x6 Source-Down
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name PQFN 5x6 Source-Down
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The power MOSFET IQDH45N04LM6 comes in a PQFN 5x6 Source-Down package. The part offers a very low RDS(on) of 0,45 mOhm combined with outstanding thermal performance for easy power loss management. This enables higher system efficiency and power density for a lot of end applications like battery-powered tools, SMPS, telecom power, and intermediate bus conversion in high-performance computing, like hyper-scale data centers and AI-server farms.

Features

  • Cutting edge 40 V silicon technology
  • Outstanding FOMs
  • Improved thermal performance
  • Ultra-low parasitics
  • Maximized chip/package ratio
  • Standard-Gate footprint

Benefits

  • Minimized conduction losses
  • Reduced voltage overshoot
  • Increased maximum current capability
  • Fast switching
  • Less device paralleling required
  • Lowest RDS(on) on a 5x6 footprint
  • Improved thermal performance
  • Easy thermal management
  • Best switching performance
  • Industry-standard package

Applications

Documents

Design resources

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }