Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
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END OF LIFE
discontinued
RoHS Compliant

IPN70R900P7S

END OF LIFE
Combining excellent performance and ease-of-use
Data Sheet
package
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IPN70R900P7S
IPN70R900P7S
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Data Sheet

Product details

  • Budgetary Price €/1k
    0.17
  • ID max
    6 A
  • ID (@25°C) max
    6 A
  • IDpuls max
    12.8 A
  • Mounting
    SMT
  • Operating Temperature
    -40 °C to 150 °C
  • Package
    SOT-223-3
  • Pin Count
    3 Pins
  • Polarity
    N
  • Ptot max
    6.5 W
  • Qgd
    2.6 nC
  • QG
    6.8 nC
  • QG (typ @10V)
    6.8 nC
  • RDS (on) (@10V) max
    900 mΩ
  • RDS (on) max
    900 mΩ
  • RthJA max
    160 K/W
  • Special Features
    price/performance
  • VDS max
    700 V
  • VGS(th)
    3 V
OPN
IPN70R900P7SATMA1
Product Status discontinued
Infineon Package
PG-SOT223-3
Package Name SOT-223-3
Packing Size 3000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
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Product Status discontinued
Infineon Package
PG-SOT223-3
Package Name SOT-223-3
Packing Size 3000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
The 700 V CoolMOS™ P7 N-channel superjunction (SJ) MOSFET series has been developed to serve the forthcoming trends in flyback topologies. The technology addresses the low-power SMPS market, mainly focusing on mobile phone chargers and notebook adapters, but suitable for power supplies used within lighting applications, home entertainment (TV, game consoles, or audio), as well as auxiliary power supplies.

Features

  • Enabling lower MOSFET chip temperature
  • Leading to higher e iciency comparedto previous technologies
  • Allowing improved form factors and slim designs
  • Drop-in replacement for DPAK atcompetitive cost
  • Space savings in designs with lowpower dissipation; enabling smaller form factors
  • Comparable thermal behavior to DPAK
  • Attractive price position for high performance technology

Documents

Documents

Design resources

Partner solutions

Developer community

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