Active and preferred
RoHS Compliant
Lead-free

IMZC140R024M2H

CoolSiC™ MOSFET discrete 1400 V in TO-247 4pin package with high creepage
ea.
in stock

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IMZC140R024M2H
IMZC140R024M2H
ea.

Product details

  • Ciss
    2290 pF
  • Coss
    78 pF
  • ID
    74 A
  • Mounting
    THT
  • Operating Temperature
    -55 °C to 175 °C
  • Package
    TO-247-4 high creepage
  • Pin Count
    4 Pins
  • Polarity
    N
  • Ptot
    330 W
  • Qgd
    16.2 nC
  • QG
    62 nC
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C)
    24 mΩ
  • RthJA max
    62 K/W
  • RthJC max
    0.46 K/W
  • Technology
    CoolSiC™ G2
  • VDS max
    1400 V
OPN
IMZC140R024M2HXKSA1
Product Status active and preferred
Infineon Package
Package Name TO-247-4 HC 8.8mm
Packing Size 240
Packing Type TUBE
Moisture Level NA
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name TO-247-4 HC 8.8mm
Packing Size 240
Packing Type TUBE
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
CoolSiC™ MOSFET discrete 1400 V, 24 mΩ G2 in TO-247 4pin combines cutting-edge SiC technology with robust high-creepage package. It enables designs with bus voltages beyond 1000 V. For existing applications, it offers both additional voltage margin and enhanced reliability. Furthermore, it allows increased switching speed leading to higher efficiency. Pin-to-pin compatible, it is suitable for PV, EV charging, and other industrial applications

Features

  • VDSS = 1400 V at Tvj = 25°C
  • RDSon = 11 mΩ at VGS = 18 V, Tvj = 25°C
  • Very low switching losses for efficiency
  • Short circuit withstand time of 2 µs
  • Wider max VGS range from -10 V to +25 V
  • Benchmark gate threshold voltage 4.2 V
  • Robustness against parasitic turn-on
  • Robust body diode
  • .XT interconnection technology 
  • Tighter VGS(th) parameter distribution 
  • High creepage TO-247 4pin package

Benefits

  • Higher power density 
  • Improved overall system efficiency 
  • Increased system output power 
  • Enhanced cooling optimization 
  • Ease of system design 
  • Robustness against transient overloads 
  • Robustness against avalanche conditions 
  • Robustness against Miller effect 
  • Ease of paralleling 
  • Very reliable package with high creepage

Documents

Design resources

Developer community

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