not for new design
RoHS Compliant
Lead-free

IDDD08G65C6

XENSIV™ - Linear control trigger for all 3D magnetic sensor 2GO Kits and Shield2Go
Data Sheet
package
board
ea.
in stock

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IDDD08G65C6
IDDD08G65C6
ea.
Data Sheet

Product details

  • I(FSM) max
    47 A
  • IF max
    8 A
  • IR
    0.8 µA
  • Package
    D-DPAK
  • Ptot max
    90 W
  • QC
    12.2 nC
  • Qualification
    Industrial
  • RthJC
    1 K/W
  • VF
    1.25 V
OPN
IDDD08G65C6XTMA1
Product Status not for new design
Infineon Package
PG-HDSOP-10
Package Name D-DPAK
Packing Size 1700
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status not for new design
Infineon Package
PG-HDSOP-10
Package Name D-DPAK
Packing Size 1700
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
Infineon Technologies introduces Double DPAK (DDPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology CoolSiC™ Schottky diode 650V G6 is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.

Features

  • Offers best-in-class VF and FOM Qc x VF
  • Improved dv/dt ruggedness
  • Easy and effective match with CoolMOS™ 7 SJ MOSFET families
  • Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
  • Reduced parasitic source inductance improves e iciency and ease-of-use
  • Enables higher power density solutions
  • Exceeding the highest quality standards

Benefits

  • Enabling highest energy efficiency
  • Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
  • Reduced parasitic source inductance improves e iciency and ease-of-use
  • Enables higher power density solutions
  • Exceeding the highest quality standards

Documents

Documents

Design resources

Partner solutions

Developer community

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