Active and preferred
RoHS Compliant
Lead-free

CYW20820

package
board
Multiple OPNs available
ea.

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CYW20820
CYW20820
ea.

Product details

  • Bluetooth Classic
    Yes
  • Bluetooth EDR 2MBPS RX SENSITIVITY
    -94 dBm
  • Bluetooth LE RX Sensitivity
    -94.5 dBm
  • Bluetooth LE TX Power
    11.5 dBm
  • Bluetooth LE
    Yes
  • Bluetooth Specification
    5.4
  • CPU
    Arm® Cortex®- M4
  • Family
    AIROC™ Bluetooth LE & Bluetooth
  • Flash
    256 kByte
  • Frequency max
    96 MHz
  • GPIOs
    22
  • Launch Date
    31-03-2018
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Operating Temperature
    -30 °C to 85 °C
  • Operating Voltage
    2.375 V to 2.625 V
  • Partner Module
    N
  • Currently planned availability until at least
    31-03-2033
  • RAM
    176 kByte
  • ROM
    1024 kByte
  • Software Support
    ModusToolbox™
Recommended
OPN
CYW20820A1KFBG CYW20820A1KFBGT
Product Status active and preferred active and preferred
Infineon Package
PG-62
PG-VFBGA-62
Package Name FBGA-62 (002-20916) FBGA-62 (002-20916)
Packing Size 4900 5000
Packing Type TRAY TAPE & REEL
Moisture Level 3 3
Moisture Packing DRY DRY
Lead-free Yes Yes
Halogen Free Yes Yes
RoHS Compliant Yes Yes
Infineon stock last updated:
 ea. in stock ea. in stock

Product Status
Active
Infineon Package
PG-62
Package Name FBGA-62 (002-20916)
Packing Size 4900
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock

Product Status
Active
Infineon Package
PG-VFBGA-62
Package Name FBGA-62 (002-20916)
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 Core compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20820 is a highly integrated device which delivers up to 11.5 dBm transmit output power in LE and BR modes and up to 2.5 dBm in EDR mode, reducing the device footprint and the costs associated with implementing Bluetooth® solutions.

Features

  • Onboard crystal oscillator
  • Passive components
  • Flash memory

Benefits

  • Support fast time-to-market
  • Support a wide spectrum of applications
  • Low power
  • Low cost

Documents

Documents

Design resources

Partner solutions

Developer community

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