Active and preferred
RoHS Compliant
Lead-free

CYW20736

AIROC™ CYW20736 Bluetooth® LE system on chip
Data Sheet
package
Multiple OPNs available
ea.

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

CYW20736
CYW20736
ea.
Data Sheet

Product details

  • Bluetooth Classic
    No
  • Bluetooth LE RX SENSITIVITY
    -93 dBm
  • Bluetooth LE TX POWER
    4 dBm
  • Bluetooth LE
    Yes
  • Bluetooth Specification
    5.4
  • CPU Frequency
    24 MHz
  • CPU
    Arm® Cortex®-M3
  • Family
    AIROC™ Bluetooth LE
  • GPIOs
    14
  • Launch Date
    31-12-2015
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Operating Temperature
    -30 °C to 85 °C
  • Operating Voltage
    1.62 V to 3.63 V
  • Partner Module
    Y
  • Planned to be available until at least
    31-12-2030
  • RAM
    60 kByte
  • ROM
    320 kByte
  • Software Support
    ModusToolbox®
Recommended
OPN
CYW20736A1KML2GT CYW20736A1KML2G CYW20736A1KWBGT
Product Status active and preferred active and preferred active and preferred
Infineon Package
PG-VQFN-32
PG-VQFN-32
SG-XFWLB-80
Package Name QFN-32 (002-13574) QFN-32 (002-13574) WLCSP-80 (002-13835)
Packing Size 2500 2450 5000
Packing Type TAPE & REEL TRAY TAPE & REEL
Moisture Level 3 3 1
Moisture Packing DRY DRY NON DRY
Lead-free Yes Yes Yes
Halogen Free Yes Yes Yes
RoHS Compliant Yes Yes Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-VQFN-32
Package Name QFN-32 (002-13574)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock

Product Status
Active
Infineon Package
PG-VQFN-32
Package Name QFN-32 (002-13574)
Packing Size 2450
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status
Active
Infineon Package
SG-XFWLB-80
Package Name WLCSP-80 (002-13835)
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
The Infineon CYW20736 is an advanced Bluetooth® Low Energy SoC that supports a wireless charging profile. The CYW20736 is designed to support the entire spectrum of Bluetooth® Low Energy use cases for the healthcare, home automation, accessory, sensor, Internet of Things, and wearable market segments.

Features

  • Single-chip Bluetooth® Low Energy SoC
  • Monolithic component
  • 32-pin, 5 mm × 5 mm 32-QFN package
  • WLCSP package
  • Supported in ModusToolbox™

Benefits

  • Low power
  • Low cost
  • Robust communications

Diagrams

CYW20736 Block Diagram
CYW20736 Block Diagram
CYW20736 Block Diagram CYW20736 Block Diagram CYW20736 Block Diagram
×
modalImg

Documents

Documents

Design resources

Partner solutions

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }