PG-DSOSP-14-84

Package details

  • Package Material
    PG
  • Package Family
    PG-DSOSP
  • Terminals
    14
  • Variant
    84
  • Exposed Paddle
    No
  • Body Length (mm)
    5.4
  • Body Width (mm)
    5.7
  • Min. Terminal Pitch (mm)
    0.65
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
    Reel diameter (mm)
     
    1800
    1
    330
Infineon dual small outline sensor pressure (DSOSP) packages are offered as different variants. The leadframe based cavity type packages feature a centrally arranged micro-electro-mechanical system (MEMS) sensor chip. The gullwing lead connection design allows for high-throughput board mounting using surface mount technology (SMT). The open signal ports in the covering lid call for extra consideration during board mounting processes. Typical products are space-efficient solutions e.g. for barometric (BAP) & manifold (MAP) sensors, pressure sensors for side crash detection (SAB), and tire pressure sensors (TPMS).

Image Gallery

PG-DSOSP-14-84_Package Outline
PG-DSOSP-14-84_Package Outline
PG-DSOSP-14-84_Package Outline PG-DSOSP-14-84_Package Outline PG-DSOSP-14-84_Package Outline
PG-DSOSP-14-84_Footprint Drawing PG-DSOSP-14-84_Footprint Drawing PG-DSOSP-14-84_Footprint Drawing
PG-DSOSP-14-84_Tape and Reel_01 PG-DSOSP-14-84_Tape and Reel_01 PG-DSOSP-14-84_Tape and Reel_01

Documents and drawings