FBGA-256 (51-85108)

P-BGA-256-801

Package details

  • Package Material
    P
  • Package Family
    P-BGA
  • Terminals
    256
  • Variant
    801
  • Exposed Paddle
    No
  • Body Length (mm)
    17.0
  • Body Width (mm)
    17.0
  • Min. Terminal Pitch (mm)
    1.0
Infineon ball grid array (BGA) packages are offered as various families. They are available as low (L), thin (T), and very thin (V) profile versions. Finepitch (F) products as well as flip-chip (FC) versions are specifically designated. Legacy designations my include ultra fine ball grid array (UFBGA) or very very thin profile fine pitch ball grid array (WFBGA). The BGA concept typically utilizes an overmolded laminate substrate with fanout to connect on the bottom of the package rather than around its perimeter. The pre-soldered ball-shaped terminations allow for high-throughput board mounting using surface mount technology (SMT). The footprints are usually symmetric and the solder ball terminations provide a stable stand-off after board mounting. Typical products are a high number of signal lines e.g. for microcontrollers and memory.

Image Gallery

P-BGA-256-801_Package Outline
P-BGA-256-801_Package Outline
P-BGA-256-801_Package Outline P-BGA-256-801_Package Outline P-BGA-256-801_Package Outline
P-BGA-256-801_Bakeable Trays P-BGA-256-801_Bakeable Trays P-BGA-256-801_Bakeable Trays
P-BGA-256-801_Footprint Drawing P-BGA-256-801_Footprint Drawing P-BGA-256-801_Footprint Drawing
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Documents and drawings

Documents and drawings