OptiMOS™-7 40 V in S3O8 3x3

Best choice for high power up to 60 A in small 3x3 mm² package footprint

Infineon offers its leading Automotive MOSFET technology OptiMOS™-7 40 V in the standard S3O8 3x3 (PG-TSDSON-8) power packages.

This new Infineon Automotive version of S3O8 3x3 (PG-TSDSON-8) offers Cu-clip connection with 60A current capability. In combination with Infineon’s leading OptiMOS™-7 40 V Power MOSFET technology, it offers best-in-class power density and power efficiency with Infineon’s well-known robust Automotive packages for highest Automotive quality.

At the same time, OptiMOS™-7 40 V offers reduced switching losses, improved SOA ruggedness and high avalanche current capability to facilitate high efficient system designs for tomorrow’s Automotive applications.

Infineon’s OptiMOS™-7 40 V S3O8 3x3 product family focuses on very cost-efficient solutions for Automotive power applications, especially power distribution, body control modules, window-lift, power-lift gate, power-seat, electric parking brake, but also high redundancy EPS systems plus all cost efficient & small BLDC drives for tomorrow’s Automotive applications in CO2-friendly vehicles.

The product family of OptiMOS™-7 40 V in the S3O8 3x3 package ranges from best-in-class 1.2 mΩ up to 4.9 mΩ per MOSFET channel.

For more information, please check our product presentation and product brief for Automotive MOSFET OptiMOS™-7 40 V S3O8:

OptiMOS™ 7 40 V S3O8 Product Presentation
OptiMOS™ 7 40V S3O8 3x3 Product Brief
Key features
  • 3x3 mm² small footprint
  • 60 A high current capability
  • Available in leading-edge OptiMOS™-7 40 V technology
  • RDS(on) range: 1.2 mΩ – 4.9 mΩ
  • Advanced leadless package with Cu-clip for low package RDS(on) and min. stray inductance
  • High avalanche capability and SOA ruggedness
Key benefits
  • Highest power and current density 
  • High thermal capacity lead-frame package 
  • Reduced conduction losses 
  • Optimized switching behavior 
  • Reduced form factor compared to traditional leaded packages
  • JEDEC industry standard package PG-TSDSON-8
Key applications
  • Power Distribution
  • Body control modules
  • Window-lift
  • Power-lift gate
  • Power-seat
  • Electric parking brake
  • High redundancy EPS
  • Small BLDC drives

Package dimensions

PG-TSDSON-8-39_Footprint
PG-TSDSON-8-39_Footprint
PG-TSDSON-8-39_Footprint
Dimensions:
  • Body length:                 3.30 mm
  • Body width:                   3.30 mm
  • Min. terminal pitch:    0.65 mm 
  • For detailed information on the S3O8 3x3 footprint dimensions, please click on the respective package (PG-TSDSON-8-39,  PG-TSDSON-8-44).