Navigating the EU CRA with Infineon

Join Our Webinar: Navigating the EU CRA with Infineon

Protect your digital connected products against cyber-attacks and comply with new EU regulations! The EU Cyber Resilience Act (EU CRA), adopted on 23rd October, 2024, mandates more cybersecurity for all connected digital products and components sold in the European Union single market, starting on December 11th 2027, manufacturers will be obligated to report security incidents to respective national agencies.

As a leading provider of semiconductors and security solutions, Infineon is dedicated to improving device security. We actively contribute to EU CRA standardization efforts and seek to help our customers as a trusted security solutions partner.

In our webinar, our experts will cover:

  • Key requirement of the EU Cyber Resilience Act and its associated standardization work
  • How Infineon products enable you to fulfil EU CRA’s essential product security requirements
  • Strategies to support you in the EU CRA's compliance journey in a timely manner

Discover how Infineon's expertise can facilitate your compliance journey.

Don't miss this opportunity to gain valuable insights around EU CRA and ensure your products are secure and compliant in the European Market.

Speakers

Daniel Hübner
Daniel Hübner

Lead Principal, IoT Security Architecture

With 20 years in semiconductors and 15 years in security and smartcards, Daniel is an expert in IoT security, NFC, and embedded secure elements. As Lead Principal for System Architecture, he drives secure solutions for payments and connected devices. His expertise spans NFC Readers & Tags, Smartcards, and Java-based eSE. Passionate about secure and scalable IoT, he is a key voice in advancing next-generation security architectures.
Daniel Hübner

Lead Principal, IoT Security Architecture

With 20 years in semiconductors and 15 years in security and smartcards, Daniel is an expert in IoT security, NFC, and embedded secure elements. As Lead Principal for System Architecture, he drives secure solutions for payments and connected devices. His expertise spans NFC Readers & Tags, Smartcards, and Java-based eSE. Passionate about secure and scalable IoT, he is a key voice in advancing next-generation security architectures.
Daniel Hübner

Lead Principal, IoT Security Architecture

With 20 years in semiconductors and 15 years in security and smartcards, Daniel is an expert in IoT security, NFC, and embedded secure elements. As Lead Principal for System Architecture, he drives secure solutions for payments and connected devices. His expertise spans NFC Readers & Tags, Smartcards, and Java-based eSE. Passionate about secure and scalable IoT, he is a key voice in advancing next-generation security architectures.
Erik Wood
Erik Wood

Senior Director of IoT Product Securityre

Erik has extensive experience in wireless sensor networks, cryptographic security, and secure memory technologies. He chairs Infineon’s IOT Security Center of Excellence that drives the IoT security strategy, defines new-product security requirements, and oversees the Edge Protect brand. Erik has chaired both the US delegation to the ISO RFID security committee and the NFC Forum security committee. He holds a bachelor’s degree in electrical engineering from UCLA and a corporate MBA from Santa Clara University.
Erik Wood

Senior Director of IoT Product Securityre

Erik has extensive experience in wireless sensor networks, cryptographic security, and secure memory technologies. He chairs Infineon’s IOT Security Center of Excellence that drives the IoT security strategy, defines new-product security requirements, and oversees the Edge Protect brand. Erik has chaired both the US delegation to the ISO RFID security committee and the NFC Forum security committee. He holds a bachelor’s degree in electrical engineering from UCLA and a corporate MBA from Santa Clara University.
Erik Wood

Senior Director of IoT Product Securityre

Erik has extensive experience in wireless sensor networks, cryptographic security, and secure memory technologies. He chairs Infineon’s IOT Security Center of Excellence that drives the IoT security strategy, defines new-product security requirements, and oversees the Edge Protect brand. Erik has chaired both the US delegation to the ISO RFID security committee and the NFC Forum security committee. He holds a bachelor’s degree in electrical engineering from UCLA and a corporate MBA from Santa Clara University.
Preeti Ohri Khemani
Preeti Ohri Khemani

Senior Director Partnership and Ecosystem Management

With over 30 years of leadership experience and 20 years in leading programs and teams delivering security semiconductor solutions, Preeti has expertise in developing, integrating and certifying security solutions for smart card and mobile payment, consumer and industrial IoT, wearables, identity and blockchain applications. She holds a graduate degree in Electronics and Telecommunication Engineering, and is an active member of several key advisory and standards boards, including Austrian Standards International, Eurosmart, NFC Forum, and FIDO Alliance.
Preeti Ohri Khemani

Senior Director Partnership and Ecosystem Management

With over 30 years of leadership experience and 20 years in leading programs and teams delivering security semiconductor solutions, Preeti has expertise in developing, integrating and certifying security solutions for smart card and mobile payment, consumer and industrial IoT, wearables, identity and blockchain applications. She holds a graduate degree in Electronics and Telecommunication Engineering, and is an active member of several key advisory and standards boards, including Austrian Standards International, Eurosmart, NFC Forum, and FIDO Alliance.
Preeti Ohri Khemani

Senior Director Partnership and Ecosystem Management

With over 30 years of leadership experience and 20 years in leading programs and teams delivering security semiconductor solutions, Preeti has expertise in developing, integrating and certifying security solutions for smart card and mobile payment, consumer and industrial IoT, wearables, identity and blockchain applications. She holds a graduate degree in Electronics and Telecommunication Engineering, and is an active member of several key advisory and standards boards, including Austrian Standards International, Eurosmart, NFC Forum, and FIDO Alliance.
Uwe Rüddenklau
Uwe Rüddenklau

Head of Global Standardization

Uwe is member of the German government Strategy Forum of Standardization, Board member of the 5G–ACIA (Alliance for Connected Industries and Automation). Additionally, he is representative at ETSI and in the 5G-AA consortium for Infineon A major part of his work is on standardization organizations like IEC, ISO, CEN, CENELEC, DKE and DIN. Recently Uwe got appointed as Chair of CENELEC Technical Committee TC47X for semiconductor devices and trusted chip implementation.
Uwe Rüddenklau

Head of Global Standardization

Uwe is member of the German government Strategy Forum of Standardization, Board member of the 5G–ACIA (Alliance for Connected Industries and Automation). Additionally, he is representative at ETSI and in the 5G-AA consortium for Infineon A major part of his work is on standardization organizations like IEC, ISO, CEN, CENELEC, DKE and DIN. Recently Uwe got appointed as Chair of CENELEC Technical Committee TC47X for semiconductor devices and trusted chip implementation.
Uwe Rüddenklau

Head of Global Standardization

Uwe is member of the German government Strategy Forum of Standardization, Board member of the 5G–ACIA (Alliance for Connected Industries and Automation). Additionally, he is representative at ETSI and in the 5G-AA consortium for Infineon A major part of his work is on standardization organizations like IEC, ISO, CEN, CENELEC, DKE and DIN. Recently Uwe got appointed as Chair of CENELEC Technical Committee TC47X for semiconductor devices and trusted chip implementation.
Navigating the EU CRA with Infineon
March 04, 2025
05:30 ( CEST )

Webinar Slides - Download here