Infineon expands 750V CoolSiC™ portfolio with top-side-cooled H-DPAK half-bridge devices for enhanced system density and reliability

Market News

Jun 02, 2026

Munich, Germany – 02 June 2026 – Power conversion architectures in automotive and industrial applications are evolving rapidly, placing new demands on switching topologies, thermal management, and system integration. To address these requirements, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the H-DPAK, a new addition to its top-side cooling package family, housing integrated half-bridge (HB) devices in 750 V CoolSiC™ G2 technology. The 750V CoolSiC G2 brings the reliability margin what modern grids and energy systems demand. The H-DPAK integrates a complete unidirectional half-bridge power stage in a single package. A split lead frame design with optimized drain pads enhances heat spreading and ensures clearance compliance in dense, high-power board layouts, while matching the industry-standard 2.3 mm height of Infineon's established Q-DPAK and TOLT packages for seamless board-level integration. The result is a liquid cooling ready, scalable, drop-in-compatible solution that reduces parasitic loop inductance for cleaner fast switching, cuts passive component size, and delivers the proven performance of CoolSiC™ technology – including excellent RDS(on) x QOSS, best-in-class RDS(on) x Qfr, and superior robustness under avalanche, overload, and short-circuit conditions. 

The H-DPAK half-bridge is engineered as a core switching cell adaptable across a broad range of power conversion topologies. Its integrated architecture enables more compact applications where the space utilization and total cost of ownership are priority. Operating at higher switching frequencies than discrete board-level solutions, the H-DPAK delivers measurable improvements in dynamic performance, enabling more compact magnetic designs and higher overall system efficiency. Target applications span the full breadth of industrial and automotive power systems:

  • Next generation HVDC AI PSU (5L ANPC)
  • HVDC Battery and Capacitor Backup Unit
  • Solid State Transformer 
  • Residential Solar and Energy storage 
  • Humanoid charging 
  • Two-stage and single-stage on-board chargers (OBCs)
  • DC-DC converters
  • Auxiliaries for electric vehicles (xEVs)

The 750V CoolSiC G2 delivers low Qg for reduced gate drive losses, high dv/dt capability for high-frequency operation, and wide gate-bias tolerance for greater design margin and compatibility with existing gate driver architectures, well suited for high-power industrial and automotive applications where robustness and switching efficiency are paramount. 

The H-DPAK expands Infineon's top-side cooled family, enabling native liquid cooling in today's most demanding and rapidly evolving applications.

Availability

Samples are available now. More information is available at www.infineon.com/coolsic-750v. 

Infineon at PCIM Europe 2026

PCIM Europe will take place in Nuremberg, Germany, from 9 to 11 June 2026. Infineon will present its products and solutions for decarbonization and digitalization in hall 7, booth 470. For press inquiries, please contact media.relations@infineon.com. Industry analysts interested in a briefing can email MarketResearch.Relations@infineon.com. Information about Infineon’s PCIM 2026 show highlights is available at www.infineon.com/pcim.  

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 57,000 employees worldwide (end of September 2025) and generated revenue of about €14.7 billion in the 2025 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

 

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Infineon’s H-DPAK is a new addition to its top-side cooling package family, housing integrated half-bridge devices in 750 V CoolSiC™ G2 technology

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Information Number : infpss202606-099

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Michael Burner

Spokesperson Consumer, Compute and Communication, PSS Division

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