Infineon pushes AI data center power supply units (PSU) to 30 kW with two new high-efficiency server power solutions

Market News

Jun 02, 2026

Munich, Germany – 02 June 2026 – Artificial intelligence workloads are redefining the power requirements of modern data centers. Rapidly increasing GPU power levels and denser rack configurations are pushing server power infrastructure to its limits. To address these challenges, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY)  introduces two system-level solutions targeting server ODMs and OEMs: an 18 kW three-phase power supply unit (PSU) reference design optimized for 50 V rack architecture, and a 30 kW three-phase interleaved T-Type PFC evaluation board designed for 800 VDC or ±400 VDC rack architectures with power sidecar. Both solutions are part of Infineon's broad AI server power delivery portfolio, helping customers accelerate time-to-market while achieving higher rack power, improved efficiency, and better thermal performance.

The 18 kW PSU reference design introduces a novel integrated energy buffer concept that smooths power draw from the grid during AI peak loads, eliminating the need for a separate capacitor bank unit. This more efficient use of stored energy reduces the required capacitor volume by up to 50 percent, cutting both component costs and physical footprint. The 30 kW PFC evaluation board leverages Infineon's CoolGaN™ semiconductor technology to deliver higher power density at lower system cost, a compelling proposition for data center operators scaling up infrastructure to meet surging AI compute demand.

The 18 kW PSU reference design achieves a peak efficiency of 97.5 percent, enabled by a carefully optimized combination of Infineon components: 650 V CoolSiC™ MOSFETs, 80 V CoolGaN™ switches, EiceDRIVER™ gate drivers, and the PSOC™ microcontroller. At the heart of the power conversion stage is a 5-level active neutral-point clamped (ANPC) PFC topology, which delivers superior efficiency across the full load range, particularly at low-to-mid load, while significantly reducing the volume of magnetic components. Compared to competing topologies, this approach achieves 0.2 percent higher peak efficiency at 50 percent load than a T-Type PFC, and 0.4 percent higher than a Vienna Rectifier.

A novel integrated planar magnetic construction enables a compact, modular, and scalable high-frequency transformer design. The energy buffer circuit guarantees a 20-millisecond hold-up time and meets stringent AI load transient requirements, supporting GPU electrical data peak processing (EDPP) loads of up to 180 percent. The reference design accepts a wide 311–528 VAC three-phase input, ensuring compatibility with global grid standards. A robust thermal management design enables reliable operation across an ambient temperature range of -5°C to 45°C. With a compact form factor of 104 × 710 × 40 mm, the solution fits standard 19-inch rack enclosures and achieves an impressive 100 W/in³ power density.

The 30 kW T-Type PFC evaluation board combines 650 V CoolGaN™ bidirectional switches in the back-to-back switching path with 1200 V CoolSiC™ MOSFETs in the high-voltage power stage, delivering a peak efficiency above 99 percent. Precise current and voltage control with fast dynamic response is achieved through the programmable power control accelerator (PPCA) integrated in the PSOC™ C3 MCU. The design maintains ultra-low input current total harmonic distortion (iTHD) below 5 percent for loads above 30 percent, and a power factor exceeding 0.99 across most of the operating load range.

Current sensing is handled by the XENSIV™ TLE4978 isolated magnetic Hall + Coil current sensor, which combines a 9 MHz bandwidth with robust common-mode transient immunity (CMTI) and high accuracy, making it well suited for next-generation SiC- and GaN-based power supply designs. The modular platform is designed for integration into a 1U full-size PSU form factor, targeting HVDC data center applications that require precise voltage regulation and strong thermal performance under the dynamic and demanding conditions of AI workloads.

Both designs are optimized for use with Infineon's broad AI server power delivery portfolio, spanning the full power chain from grid to core. This includes solid-state transformers and circuit breakers, power supply and battery backup units, intermediate bus converters, and second-stage DC conversion power modules. By combining the complementary strengths of silicon (Si), silicon carbide (SiC), and gallium nitride (GaN), Infineon offers customers a clear, proven path to end-to-end power architectures. The portfolio is supported by consistent design resources and scalable, high-quality components tailored to next-generation AI server platforms.

Availability

Both the 18 kW three-phase PSU reference design and the 30 kW three-phase T-Type PFC evaluation board will be available for evaluation soon. More information, including design documentation and product details, is available here.

Infineon at PCIM Europe 2026

PCIM Europe will take place in Nuremberg, Germany, from 9 to 11 June 2026. Infineon will present its products and solutions for decarbonization and digitalization in hall 7, booth 470. For press inquiries, please contact media.relations@infineon.com. Industry analysts interested in a briefing can email MarketResearch.Relations@infineon.com. Information about Infineon’s PCIM 2026 show highlights is available at www.infineon.com/pcim.  

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 57,000 employees worldwide (end of September 2025) and generated revenue of about €14.7 billion in the 2025 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

 

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The 18 kW PSU reference design achieves a peak efficiency of 97.5 percent, enabled by a carefully optimized combination of Infineon components

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Information Number : infpss202606-094

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Michael Burner

Spokesperson Consumer, Compute and Communication, PSS Division

+49 89 234 39300

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